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1.发明授权Process for manufacturing an insulated interconnection through a body of semiconductor material and corresponding semiconductor device 有权一种用于制备经由穿过半导体主体分离和相关联的半导体器件的工艺
公开(公告)号：EP1351288B1
公开(公告)日：2015-10-28
申请号：EP02425207.4
申请日：2002-04-05
Applicant: STMicroelectronics Srl
Inventor： Mastromatteo, Ubaldo , Ferrari, Paolo
IPC: H01L21/768 , H01L23/48
CPC classification number: H01L21/76898 , H01L23/481 , H01L2224/0401 , H01L2224/05009 , H01L2224/05572 , H01L2224/13025 , H01L2924/00014 , H01L2924/0002 , H01L2924/1461 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
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