中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

3 records (took 0.018 seconds)

    Method and structures for indexing dice
    1.
    发明公开
    Method and structures for indexing dice 有权
    方法和结构索引芯片

    公开(公告)号：EP2282338A3

    公开(公告)日：2012-10-24

    申请号：EP10183726.8

    申请日：2004-04-19

    Applicant: STMicroelectronics Srl

    Inventor： Brambilla, Daniele Alfredo ,  Valtolina, Marco Natale

    IPC: H01L23/544

    CPC classification number: H01L23/544 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54466 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of indexing a plurality of dice (410;710;810) obtained from a material wafer (100) comprising a plurality of stacked material layers, each die being obtained in a respective die position (1-16) in the wafer, the method including providing a visible index (420;720;820) on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure (422,425,430;725,730;730,825, 826) adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker (435;745,775,780;775,780,845) associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.

Patent Agency Ranking