Abstract:
Apparatus (200, 300, 400) for component positioning comprises at least one receptacle (212, 412) configured to receive a number of components (103) to be placed on a target substrate (108, 111),agitator (210, 410) configured to exert force impulses, such as abrupt force impulses, on the receptacle so as to cause the components to change their position inside the receptacle,inspection equipment (216, 316, 416) configured to verify the position of the components inside the receptacle, and pick and place equipment (206, 306, 406) configured to pick one or more components from the receptacle that fulfil a predefined position criterion and place the components on the target substrate.A related method for component positioning is presented.
Abstract:
A method (200, 300, 500) for producing an electrically conductive pattern on substrate (202, 402), comprising: providing electrically conductive solid particles onto an area of the substrate in a predefined pattern (508), where the pattern (403) comprises a contact area (404B) for connecting to an electronic component and a conductive structure (404A) having at least a portion (414) adjacent to the contact area, heating the conductive particles to a temperature higher than a characteristic melting point of the particles to establish a melt (510), and pressing the melt against the substrate in a nip, the temperature of the contact portion of which being lower than the aforesaid characteristic melting point so as to solidify the particles into essentially electrically continuous layer within the contact area and within the conductive structure in accordance with the pattern (512), wherein the thermal masses of the contact area and the at least adjacent portion of the conductive structure are configured substantially equal.
Abstract:
A chip (201) is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip (205, 206).
Abstract:
A system for monitoring the life cycle of a product even in open-loop retail environment having regard to the associated supply or value chain, comprising tag provision equipment arranged to obtain product information and to configure a wirelessly interrogatable electronic identification tag provided with externally readable identification information to a product item, wherein configuring incorporates at least partially automated determination, according to predefined decision logic, of at least one technical characteristic of tag implementation based on the product information to optimize the operation of the tag, and electronic data management system accessible via a communications network, preferably the Internet, comprising a data interface configured to receive and transmit data, and a data repository configured to store indications of received digital notifications of tag reading events in a plurality of activities of the associated supply or value chain, said notifications conveying said tag identification information. A corresponding method for execution by the system is presented.
Abstract:
The invention refers to a method to produce a packaging material comprising the steps of; treating at least one surface of a paperboard substrate with a binder and with a metal salt, printing at least a part of said treated surface with ink, and applying at least one polymer layer on said printed surface. The packaging material produced in accordance with the invention shows good printability and simultaneously good adhesion of the applied polymer layer.
Abstract:
A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.
Abstract:
A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.
Abstract:
An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.
Abstract:
A system for monitoring the life cycle of a product even in open-loop retail environment having regard to the associated supply or value chain, comprising tag provision equipment arranged to obtain product information and to configure a wirelessly interrogatable electronic identification tag provided with externally readable identification information to a product item, wherein configuring incorporates at least partially automated determination, according to predefined decision logic, of at least one technical characteristic of tag implementation based on the product information to optimize the operation of the tag, and electronic data management system accessible via a communications network, preferably the Internet, comprising a data interface configured to receive and transmit data, and a data repository configured to store indications of received digital notifications of tag reading events in a plurality of activities of the associated supply or value chain, said notifications conveying said tag identification information. A corresponding method for execution by the system is presented.