5.
    发明专利
    未知

    公开(公告)号:DE69432546T2

    公开(公告)日:2003-11-20

    申请号:DE69432546

    申请日:1994-09-16

    Abstract: A powder metallurgy injection molding process using infiltration to manufacture net-shape products comprising steps of mixing tungsten powder and nickel powder having average particle sizes equal to or less than 40 mu m so as to form mixed metal powder, kneading the mixed metal powder with an organic binder so as to form'a admixture, injection molding said admixture so as to form a predetermined green shape, debinderizing said green shape and infiltrating copper into the green shape so as to produce a net-shape product.

    6.
    发明专利
    未知

    公开(公告)号:DE69432546D1

    公开(公告)日:2003-05-28

    申请号:DE69432546

    申请日:1994-09-16

    Abstract: A powder metallurgy injection molding process using infiltration to manufacture net-shape products comprising steps of mixing tungsten powder and nickel powder having average particle sizes equal to or less than 40 mu m so as to form mixed metal powder, kneading the mixed metal powder with an organic binder so as to form'a admixture, injection molding said admixture so as to form a predetermined green shape, debinderizing said green shape and infiltrating copper into the green shape so as to produce a net-shape product.

    MOUNTING SUBSTRATE FOR HIGH-SPEED LASER DIODE

    公开(公告)号:JPS6437891A

    公开(公告)日:1989-02-08

    申请号:JP19404187

    申请日:1987-08-03

    Abstract: PURPOSE:To package a high-speed laser diode with high density, and to operate it at high speed by specifically setting the characteristic impedance of an input signal conductor for an IC and a signal conductor reaching a laser from the IC and forming terminal resistors near an IC for drive and the laser diode. CONSTITUTION:An IC chip for drive is set up to an IC fitting seat 3 shaped near the center of a ceramic board 1. IC power lines 7, 8 to an IC for drive are formed by wide windings reaching the fitting seat 3 from the periphery of the ceramic board 1. IC input signal conductors 5, 6 are shaped from the periphery of the ceramic board 1 to a section near the fitting seat 3, and the line width of the signal conductors 5, 6 is formed constantly. A ground plane 16 is shaped on the rear of the ceramic board 1. Consequently, the characteristic impedance of the signal conductors 5, 6 is formed within a range of 45-55OMEGA. Terminal resistors 12, 13 are shaped to the signal conductors 5, 6. An IC laser connecting wire 4 to a laser diode fitted to a laser fitting seat 2, terminal resistors 11, 12 and a laser power line 9 are also formed in the same manner as mentioned above.

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