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公开(公告)号:JPH1048370A
公开(公告)日:1998-02-20
申请号:JP20203096
申请日:1996-07-31
Applicant: JAPAN ATOMIC ENERGY RES INST , SUMITOMO HEAVY INDUSTRIES
Inventor: OKUNO KENJI , YOKOGAWA NOBUHISA , SAKAI FUMIO
Abstract: PROBLEM TO BE SOLVED: To accurately calculate tritium amount captured in whole surface area by casting ultraviolet laser, giving material surface abrasion and uniformly vaporizing or gasifying only within the irradiation area with photochemical effects. SOLUTION: Ultraviolet laser transmitted through a fiber 24 is focused with a lens 26 and casted on a specific area surface of a material 20. On the surface of the material 20 irradiated by the ultraviolet laser, abrasion is caused and the surface is ground according to the energy density and shot number. Tritium dissociated from the surface by the abrasion is extracted out through an exhaust pipe 28. By measuring the tritium amount in the exhaust air with a quadrupole mass analyzer 30 connected with the exhaust pipe 28, the tritium in the area of abrasion can be measured. By examining the measured tritium amount as a function of depth, the captured tritium amount as a function of the depth in the surface layer of the material 20 can be measured.
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公开(公告)号:JPH09122940A
公开(公告)日:1997-05-13
申请号:JP28979495
申请日:1995-11-08
Applicant: SUMITOMO HEAVY INDUSTRIES
Inventor: SAKAI FUMIO , HAYASHI KENICHI
Abstract: PROBLEM TO BE SOLVED: To eliminate fine crack generation due to heating at marking and to reduce a running cost by using a solid-state laser beam as an exciting laser in laser beam marking, converting it to a higher harmonic laser beam of ultraviolet rays wave length and irradiating a glass surface. SOLUTION: A solid-state laser beam (arrow mark 10) generated by a laser oscillator 1 is inputtted to a a wave length converter 2 to be converted to a fourth higher harmonic or a fifth higher harmonic laser beam (arrow mark 20). The surface of a glass substrate 5 placed on a XY stage 6 is irradiated with the higher harmonic laser beam having an oscillating wave length of the ultraviolet region. Further, the used solid-state laser is either of Nd-YAG laser, Nd-YLF laser, or Nd-glass laser. Also, when the glass substrate 5 is irradiated with the converted higher harmonic laser beam 20, the inert gas of He, N, etc., is blown to an irradiating face.
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公开(公告)号:JPH08340165A
公开(公告)日:1996-12-24
申请号:JP14371995
申请日:1995-06-09
Applicant: SUMITOMO HEAVY INDUSTRIES
Inventor: KUWABARA TAKASHI , SAKAI FUMIO
IPC: B23K26/352 , B23K26/382 , H05K3/00 , H05K3/46 , B23K26/00
Abstract: PURPOSE: To provide a method of forming a via hole, which makes a high-speed processing possible and simplifies a post treatment process. CONSTITUTION: A laser processing device has a first laser oscillation part 11, which generates an infrared laser beam, a second laser oscillation part 12, which generates an ultraviolet laser beam from a visible range, mirrors 13 and 14, which make the laser beams from these laser oscillation parts incident perpendicularly on a material 17 to be processed, and focusing lens 15 and 16, which make the laser beams focus, and the ultraviolet-range laser beam is emitted to a hole formed in a polymer layer by the infrared laser beam from the visible range to make a metal conductive layer under the polymer layer expose.
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公开(公告)号:JP2002025798A
公开(公告)日:2002-01-25
申请号:JP2000206277
申请日:2000-07-07
Applicant: SUMITOMO HEAVY INDUSTRIES , JAPAN ATOMIC ENERGY RES INST
Inventor: HORI TOSHITADA , SAKAI FUMIO , KAMIKADO MASAKI
Abstract: PROBLEM TO BE SOLVED: To provide a nondestructive electron beam monitoring method for a microtron which is superior in quantitative evaluation for current amount of an electron beam, in the microtron accelerating electron beam of ultrashort pulses. SOLUTION: The microtron 10 has an electron gun 40 for generating an electron beam of ultrashort pulses, an accelerating tube 110 inputted with microwave power for accelerating electrons, and electromagnets 120A, 120B deflecting an electron path Oe. The microtron 10 accelerates the electrons to a required energy, by making the electrons injected into the accelerating tube 110 plural number of times. In the microtron 10, a current transformer monitor 20 nondestructively measures the current of the electron beam and a temporal waveform of the current is disposed coaxially with the accelerating tube 110, and the current amount of the electron going around in the microtron 10 in each turn is measured by analyzing the signal from the monitor 20 by an oscilloscope 30 with the lapse of time.
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公开(公告)号:JPH08153922A
公开(公告)日:1996-06-11
申请号:JP31432694
申请日:1994-11-25
Applicant: SUMITOMO HEAVY INDUSTRIES
Inventor: SAKAI FUMIO
IPC: H01S3/038 , H01S3/0977 , H01S3/225
Abstract: PURPOSE: To uniformalize generation of ultraviolet rays by uniforming corona discharge, improve performance of corona preionizing, realize long life of gas medium of an excimer laser or other gas lasers, and stabilize output. CONSTITUTION: A conductor wire member 21 is interposed between the sharp end part 7A of an electrode for corona (an anode 7 for corona) and an insulating member 9. Thereby the numbers of contact points for generating corona discharge can be increased. The conducting wire member 21 is wound around the insulating member 9 of a corona preliminary electrode 6 in order to uniform corona discharge.
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公开(公告)号:JPH0697541A
公开(公告)日:1994-04-08
申请号:JP26678492
申请日:1992-09-10
Applicant: SUMITOMO HEAVY INDUSTRIES
Inventor: SAKAI FUMIO
IPC: H01S3/03
Abstract: PURPOSE:To use rare gas like Kr without waste which gas is previously adsorbed by adsorbent, prior to laser operation. CONSTITUTION:Considering that, before a laser 1 is practically operated, so- called shakedown is performed wherein the laser 1 is oscillated with operating gas composition called passivation, or the total exchange of gas is performed after some operation time. The title gas purifying apparatus 4 for an excimer laser which oscillates while circulating gas medium for laser oscillation which contains rare gas through a laser tube 2 and an adsorbing tower 9 containing adsorbent. Prior to laser oscillation, rare gas can be previously adsorbed by adsorbent contained in the adsorbing tower. As the rare gas to be previously adsorbed, the rare gas in the gas medium for laser oscillation which has been used in the preceeding laser oscillation is used.
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公开(公告)号:JPH04135626A
公开(公告)日:1992-05-11
申请号:JP25812390
申请日:1990-09-27
Applicant: SUMITOMO HEAVY INDUSTRIES
Inventor: SAKAI FUMIO
IPC: B01D59/16
Abstract: PURPOSE:To obtain high safety and high separating efficiency by cooling the cold wall of a thermal diffusion tower with a refrigerant and repeatedly using the refrigerant by a closed system through a refrigerator. CONSTITUTION:Gas contg. isotopes is fed into the space between the peripheral cold wall of a refrigerant jacket 11 and the peripheral warm wall of a heating element 6 through gas inflow/outflow holes 4, 5 and the isotopes are separated. At this time, the warm wall is heated by supplying heat, the cold wall is cooled to ordinary temp. or below with an He refrigerator 15 and the used refrigerant is returned to the refrigerator 15 and used again in a closed cycle. High safety and high separating efficiency can be obtd.
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公开(公告)号:JP2002298775A
公开(公告)日:2002-10-11
申请号:JP2001103788
申请日:2001-04-02
Applicant: SUMITOMO HEAVY INDUSTRIES
Inventor: YOU KINHOU , SAKAI FUMIO , AOKI YASUSHI
IPC: H01J37/073 , H01J49/08 , H01J49/44
Abstract: PROBLEM TO BE SOLVED: To provide a compact short pulse electron beam generating device capable of generating a short pulse, in particular a pulse electron beam in a time period of sub picosecond, and a small-sized pulse electron spectroscopic analyzing device. SOLUTION: The short pulse electron beam generating device 10 is provided with a short pulse laser generating device 20 for generating an electron, a photo cathode high frequency electron gun 200, a synchronous circuit 40 for synchronizing a short pulse laser and a high frequency, and an α electromagnet 30 for reducing pulse duration of the short pulse electron beam. The small-sized pulse electron spectroscopic analyzing device is provided with the short pulse electron beam generating device 10, a spectroscopic short pulse laser generating device 80, a synchronous circuit for synchronizing the short pulse laser and the high frequency, and a measuring instrument for measuring the short pulse laser passing though a sample for spectroscopic analyzing.
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公开(公告)号:JPH11103150A
公开(公告)日:1999-04-13
申请号:JP21877698
申请日:1998-08-03
Applicant: SUMITOMO HEAVY INDUSTRIES
Inventor: KUWABARA TAKASHI , SAKAI FUMIO
IPC: B23K26/352 , B23K26/382 , H05K3/00 , H05K3/46 , B23K26/00
Abstract: PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus in which a machining speed can be enhanced, by a method wherein a two-axis scanning mirror which is used to scan a laser beam from a laser oscillator inside an X-Y plane on a printed circuit board is provided and an of lens which is used to make the laser beam incident on the printed circuit board is provided. SOLUTION: A laser beam from a laser oscillator 11 is radiated to a two-axis scanning mirror 12 in which two mirrors capable of being turned to mutually different directions are combined, and it is scanned inside an X-Y plane on a printed circuit board 15. That is to say, the laser beam from a first mirror is deflected to the X-axis direction in its scanning range on the printed circuit board 15, and the laser beam from the first mirror is deflected to the Y-axis direction in its scanning range on the printed circuit board 15. The two-axis scanning mirror 12 is combined with an fθ lens 15, an X-Y stage 14 is used within the scanning range of the two-axis scanning mirror 12, and a via hole can be formed in a desired position in the scanning range even when the printed circuit board 15 is not moved.
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公开(公告)号:JPH11103149A
公开(公告)日:1999-04-13
申请号:JP21877598
申请日:1998-08-03
Applicant: SUMITOMO HEAVY INDUSTRIES
Inventor: KUWABARA TAKASHI , SAKAI FUMIO
IPC: B23K26/00 , B23K26/382 , H05K3/00 , H05K3/26 , H05K3/46
Abstract: PROBLEM TO BE SOLVED: To provide a forming method in which the machining time of a via hole can be shortened without a complicated wet pretreatment, by a method wherein the via hole which reaches a metal film is formed, by a laser beam, in a polymer film on the metal film and a via-hole machined residue is removed by a dry treatment. SOLUTION: Respective laser beams are scanned, inside the face of an X-Y stage 18, by a first scanning mirror 13 and a second scanning mirror 14 in which two mirrors capable of being turned to mutually different directions are combined so as to correspond to a first solid-state laser oscillation part 11 used to radiate an infrared-range laser beam and to a second excimer laser oscillation part 12 used to radiate an ultraviolet or visible-range laser beam. A first converging fθ lens 15 and a second converging fθlens 16 focus the laser beams so as to be incident vertically on an object 17, to be machined, irrespective of angles of incidence of the respective laser beams from the two-axis scanning mirrors 13, 14. Then, the two-axis scanning mirrors 13, 14 are combined with the fθ lenses 15, 16, a via hole can be formed in a prescribed position on the object 17, to be machined, even when the object 17 to be machined is not moved by using the X-Y stage 18. Consequently, a machined residue can be removed simultaneously.
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