中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

10 records (took 0.025 seconds)

    COOLING OF DYNAMOELECTRIC MACHINES
    1.
    发明申请
    COOLING OF DYNAMOELECTRIC MACHINES 审中-公开
    电动机的冷却

    公开(公告)号：WO1986007211A1

    公开(公告)日：1986-12-04

    申请号：PCT/US1986001138

    申请日：1986-05-22

    Applicant: SUNDSTRAND CORPORATION

    Inventor： SUNDSTRAND CORPORATION ,  SUTRINA, Thomas, A. ,  BLAND, Timothy, J.

    IPC: H02K09/19

    CPC classification number: H02K9/19

    Abstract: Windage losses in the air gap (22) of a dynamoelectric machine and normally associated with direct contact liquid cooling are avoided through the provision of a first weir (42, 44) radially inwardly of rotor conductors (40) and a second weir (72, 76, 78) radially and axially outwardly of the first weir (42, 44) which provides a fan-like spray of coolant on stator end turns (34) at a location remote from the air gap (22).

    HERMETICALLY SEALED COMPRESSION BONDED CIRCUIT ASSEMBLY
    2.
    发明申请
    HERMETICALLY SEALED COMPRESSION BONDED CIRCUIT ASSEMBLY 审中-公开
    密封式密封电路组装

    公开(公告)号：WO1990001798A1

    公开(公告)日：1990-02-22

    申请号：PCT/US1989003165

    申请日：1989-07-21

    Applicant: SUNDSTRAND CORPORATION

    Inventor： SUNDSTRAND CORPORATION ,  CROWE, Lawrence, E. ,  SUTRINA, Thomas, A.

    IPC: H01L23/16

    CPC classification number: H01L25/112 ,  H01L2924/0002 ,  Y10S257/909 ,  H01L2924/00

    Abstract: A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded. The individual hermetically sealed circuit assemblies have circular corrugations (32-40) in a flat surface (14) and circular corrugations (114-122) in a lid (20) which are disposed within the columns containing the individual circuit elements to be compression bonded.

    Abstract translation: 一种制造具有被压接的电路元件（74,76,78和80）的气密密封电路组件（10）的方法，具有要被压接的电路元件的气密密封电路组件和包含至少一个气密密封电路 公开了具有被压接的电路元件的组件。 通过在包含要压缩的电路元件的列中定位可变形间隔物（124-132）并使可变形间隔物变形来确保跨柱（22-30）测量的各个气密密封电路组件的均匀厚度。 此后，通过包含待压接的电路元件的列将压力施加到一个或多个电路的堆叠。 单独的密封电路组件在平坦表面（14）中具有圆形波纹（32-40）和在盖（20）中的圆形波纹（1​​14-122），其设置在包含要压缩的各个电路元件的列内 。

    HERMETICALLY SEALED COMPRESSION BONDED CIRCUIT ASSEMBLY
    4.
    发明申请
    HERMETICALLY SEALED COMPRESSION BONDED CIRCUIT ASSEMBLY 审中-公开
    密封式密封电路组装

    公开(公告)号：WO1990001800A1

    公开(公告)日：1990-02-22

    申请号：PCT/US1989003168

    申请日：1989-07-21

    Applicant: SUNDSTRAND CORPORATION

    Inventor： SUNDSTRAND CORPORATION ,  CROWE, Lawrence, E. ,  SUTRINA, Thomas, A.

    IPC: H01L23/32

    CPC classification number: H01L25/112 ,  H01L2924/0002 ,  Y10S257/909 ,  H01L2924/00

    Abstract: A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compresssion bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded. The individual hermetically sealed circuit assemblies have circular corrugations (32-40) in a flat surface (14) and circular corrugations (114-122) in a lid (20) which are disposed within the columns containing the individual circuit elements to be compression bonded.

    COOLED STACK OF ELECTRICALLY ISOLATED SEMICONDUCTORS
    5.
    发明申请
    COOLED STACK OF ELECTRICALLY ISOLATED SEMICONDUCTORS 审中-公开
    电绝缘半导体冷却堆

    公开(公告)号：WO1986007193A1

    公开(公告)日：1986-12-04

    申请号：PCT/US1986001149

    申请日：1986-05-22

    Applicant: SUNDSTRAND CORPORATION

    Inventor： SUNDSTRAND CORPORATION ,  SUTRINA, Thomas, A.

    IPC: H01L23/02

    CPC classification number: H01L23/473 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Electrical isolation of semiconductors in a stack with interposed heat sinks is attained through the use of a thin sheet (30) of electrical insulating material disposed between first and second, electrically conductive heat sink elements (26), (28), each having a planar surface (32), (34) and an opposite surface (12), (14) configured to make good electrical and thermal contact with a semiconductor (16), (18), (20). Each heat sink element (26), (28) has a pair of ports (42), (44), (46) that may act as inlets or outlets and an internal conduit (54) interconnecting the same. The conduit (54) is in heat transfer relation to the sides (12) and (14) and the elements (26), (28) sandwich the sheets (30) between the planar sides (32) and (34). Adhesive (88), (90) bonds the planar surfaces (32) and (34) to the sheet (30).

    POWER SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE
    6.
    发明申请
    POWER SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE 审中-公开
    功率半导体集成电路封装

    公开(公告)号：WO1994008357A1

    公开(公告)日：1994-04-14

    申请号：PCT/US1993008665

    申请日：1993-09-07

    Applicant: SUNDSTRAND CORPORATION

    Inventor： SUNDSTRAND CORPORATION ,  SUTRINA, Thomas, A.

    IPC: H01L23/28

    CPC classification number: H01L24/72 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A hermetically sealed semiconductor package (10, 100, 200) in accordance with the invention includes at least one integrated circuit (14, 15 or 16) with each integrated circuit having first (20) and second (22) opposed faces with the first face having at least one electrode (17-19) providing at least one first circuit connection to the integrated circuit with the second face providing a second circuit connection to the integrated circuit; a thermally conductive base (32) thermally coupled to the second face for conducting heat generated by operation of the at least one integrated circuit; an insulator (30) electrically isolating the first circuit connection from the second circuit connection; a sidewall (34) extending upward from the base.

    Abstract translation: 根据本发明的密封半导体封装（10,100,200）包括至少一个集成电路（14,15或16），每个集成电路具有第一（20）和第二（22）相对面，所述第一面 具有至少一个电极（17-19），其向所述集成电路提供至少一个第一电路连接，所述第二面提供到所述集成电路的第二电路连接; 热传导基座（32），其热耦合到所述第二面，用于传导由所述至少一个集成电路的操作产生的热; 绝缘体（30）将所述第一电路连接与所述第二电路连接电隔离; 从基座向上延伸的侧壁（34）。

    HERMETICALLY SEALED COMPRESSION BONDED CIRCUIT ASSEMBLY
    7.
    发明申请
    HERMETICALLY SEALED COMPRESSION BONDED CIRCUIT ASSEMBLY 审中-公开
    密封式密封电路组装

    公开(公告)号：WO1990001799A1

    公开(公告)日：1990-02-22

    申请号：PCT/US1989003167

    申请日：1989-07-21

    Applicant: SUNDSTRAND CORPORATION

    Inventor： SUNDSTRAND CORPORATION ,  CROWE, Lawrence, E. ,  SUTRINA, Thomas, A.

    IPC: H01L23/32

    CPC classification number: H01L25/112 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers. Therafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded. The individual hermetically sealed circuit assemblies have circular corrugations (32-40) in a flat surface (14) and circular corrugations (114-122) in a lid (20) which are disposed within the columns containing the individually circuit elements to be compression bonded.

    Abstract translation: 一种制造具有被压接的电路元件（74,76,78和80）的气密密封电路组件（10）的方法，具有要被压接的电路元件的气密密封电路组件和包含至少一个气密密封电路 公开了具有被压接的电路元件的组件。 通过在包含要压缩的电路元件的列中定位可变形间隔物（124-132）并使可变形间隔物变形来确保跨柱（22-30）测量的各个气密密封电路组件的均匀厚度。 压缩力通过包含待压接的电路元件的列施加到一个或多个电路的堆叠。 单独的密封电路组件在平坦表面（14）中具有圆形波纹（32-40）和盖（20）中的圆形波纹（1​​14-122），其设置在包含要压缩粘合的单独电路元件的列内 。

    COOLED STACK OF ELECTRICALLY ISOLATED SEMICONDUCTORS
    9.
    发明公开
    COOLED STACK OF ELECTRICALLY ISOLATED SEMICONDUCTORS 失效
    电位隔离SEMICONDUCTORS冷藏堆栈。

    公开(公告)号：EP0225919A1

    公开(公告)日：1987-06-24

    申请号：EP86903906.0

    申请日：1986-05-22

    Applicant: SUNDSTRAND CORPORATION

    Inventor： SUTRINA, Thomas, A.

    IPC: H05K7 ,  H01L23 ,  H01L25 ,  H02M7

    CPC classification number: H01L23/473 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: On obtient l'isolation électrique de semiconducteurs empilés avec des puits de dispersion de chaleur interposés en disposant une mince feuille (30) de matériau électriquement isolant entre un premier et un deuxième dispositifs (26, 28) de dispersion de chaleur életriquement conducteurs ayant chacun une surface plate (32), (34) et une surface opposée (12), (14) formée de façon à faire un bon contact électrique avec un semiconducteur (16), (18), (20). Chaque dispositif de disperssion de chaleur (26), (28) comprend une paire d'orifices (42), (44), (46) qui peuvent servir d'orifices d'admission ou d'évacuation et un conduit interne (54) qui les interconnecte. Le conduit (54) en relation de transfert de chaleur avec les côtés (12) et (14), et les dipositifs (26), (28) serrent les feuilles (30) entre les surfaces plates (32) et (34). Un adhésif (88), (90) relie les surfaces plates (32) et (34) à la feuille (30).

    COOLING OF DYNAMOELECTRIC MACHINES
    10.
    发明公开
    COOLING OF DYNAMOELECTRIC MACHINES 失效
    冷却DYNAMO电式机器。

    公开(公告)号：EP0222898A1

    公开(公告)日：1987-05-27

    申请号：EP86903895.0

    申请日：1986-05-22

    Applicant: SUNDSTRAND CORPORATION

    Inventor： SUTRINA, Thomas, A. ,  BLAND, Timothy, J.

    IPC: H02K9

    CPC classification number: H02K9/19

    Abstract: On évite les pertes par frottement d'air dans l'entrefer (22) d'une machine dynamo-électrique normalement associées au refroidissement par contact direct avec un liquide en formant un premier déversoir (42, 44) radialement à l'intérieur des conducterus (40) du rotor et un deuxième déversoir (72, 76, 78) radialement et axialement à l'extérieur du premier déversoir (42, 44), ce qui crée un jet de réfrigérant vaporisé en éventail sur les spires terminales (34) du stator à un endroit éloigné de l'entrefer (22).

Patent Agency Ranking