Abstract:
A device and method for providing a device suitable for microwave and/or RF applications comprising an HTS film (4) having low surface resistance and exhibiting linear response characteristics at high RF current density is provided. Broadly, a two-step process of first, in situ forming an intermediate layer of YBCO (2) (or a structural analog) used as a nucleation layer on a support layer (1), and second forming a thallium and copper oxide based film (4) on the intermediate layer (2) by precursor (3) deposition followed by a post-deposition thermal processing for crystallization.
Abstract:
An a-axis high temperature superconducting film having preferential in-plane orientation is formed. In the preferred embodiment, an a-axis film has substantial amounts of superconductor (12) oriented with its c-axis in a unified direction parallel to the substrate (16). YBCO on neodium gallate (110) plane has resulted in a high temperature superconductor with over 80 % by volume being a-axis with in-plane orientation. These films are epitaxial. The preferred method of film growth is for in situ growth by a laser ablation. Preferably, the a-axis film is nucleated by laser ablation onto a substrate which is at a temperature of 50 to 100 DEG C less than the optimal substrate temperature for c-axis growth. Optionally, once a-axis nucleation has begun, the substrate temperature may be increased to optimize superconductor properties.
Abstract:
An electrical interconnect provides a path between cryogenic or cryocooled circuitry and ambient temperatures. As a system, a cryocable (10) is combined with a trough-line contact or transition (20). In the preferred embodiment, the cryocable (10) comprises a conductor (11) disposed adjacent an insulator (12) which is in turn disposed adjacent another conductor (13). The components are sized so as to balance heat load through the cryocable (10) with the insertion loss. In the most preferred embodiment, a coaxial cryocable (10) has a center conductor (11) surrounded by a dielectric (12) (e.g. Teflon ) surrounded by an outer conductor (13) which has a thickness between about 6 and 20 microns. The heat load is preferably less than one Watt, and most preferably less than one tenth of a Watt, with an insertion loss less than one decibel. In another aspect of the invention, a trough-line contact or transition (20) is provided in which the center conductor (11) is partially enveloped by dielectric (12) to form a relatively flat portion (28). The preferred overall geometry of the preferred embodiment of the cable is generally cylindrical, although other geometries are possible (e.g. stripline, microstrip, coplanar or slotline geometries).
Abstract:
Methods and reactors are described for the production of high temperature superconductor films on a variety of substrates, particularly those films which include volatile components during their manufacture. The reactors are particularly useful for producing films containing thallium. The reactors parts (10, 12, 14, 16) provide for relatively low volume cavities in which the substrate (22) is disposed, and control of the thallium oxide overpressure during the processing. In a preferred embodiment, one or more holes or apertures are made in the reactor to permit thallium and thallium oxide to controllably leak from the reactor. For manufacture of double sided superconducting films, a reactor is used having top (14) and bottom (10) plates each with one or more holes in them (18, 20). Uniform high temperature superconducting films are obtained while inhibiting reaction between the substrate and superconducting film during the processing.
Abstract:
A coating for high temperature superconducting devices consists of polyimide. In the preferred embodiment, the polyimide Probamide 412 is utilized to provide a passivation coating for thallium containing or YBCO superconductors. A substantially planar local structure is formed which may be utilized as the base for further structures, such as metallizations. A method for providing polyimide passivation coating on superconductors comprises generally the steps of coating the superconductor with the polyimide, optionally patterning the polyimide with photolithographic techniques, and curing the polyimide by a baking step.
Abstract:
A detector for electromagnetic radiation includes a high Q, low loss antenna (56, 58) and a low noise amplifier (66) requiring a high input impedance. In the preferred embodiment, the antenna comprises a low resistance (58), superconductive coil (56). The antenna forms a resonant circuit with a low loss capacitor (64), optionally a capacitor including superconductors. The output of the resonant circuit is provided as input to the semiconductor amplifier. In the preferred embodiment, junction FETs, preferably arranged in a cascode pair, are included in the semiconductor amplifier. In one aspect of the invention, feedback is provided from the output of the amplifier to its input. Effective loading of the antenna results, lowering the Q of the antenna, and broadening the bandwidth of the detector. Optimum matching of the antenna to the noise factor of the amplifier is achieved.
Abstract:
Control elements for RF antennas including high temperature superconducting capacitors (24) are formed. In one embodiment, a high temperature superconducting capacitor (24) is coupled to an inductor (22) to form a resonant circuit (20). In another embodiment a high temperature superconducting capacitor (32) is used to make a low-resistance cross-over (33) for an inductor (31). Additional circuits include circuits which do not use non-superconducting materials in the circuit, circuits which have coupled superconducting inductors (50, 51) for low-loss signal coupling, tuning and bandwidth broadening, and circuits which include switches to shut off the superconductivity of a superconductive element including low-loss photoconducting (70) and superconducting thermal (61) switches. These circuits are useful in Magnetic Resonance Imaging devices.
Abstract:
A multichip interconnect module utilizes superconducting conductors to provide improved speed and reduced power dissipation. In one embodiment, x-direction and y-direction conductor units each comprise a substrate (30, 32) having alternating superconducting conductors (20) and ground plane lines (22), where the ground plane lines (22) are connected by bridge-like interconnects (24), where the x-direction and y-direction conductor units are selectively electrically connected. In another embodiment, a superconducting microstrip arrangement utilizes two or more structures having a substrate (30, 32), ground plane (20), insulator (46) and superconducting conductor stacked structure (22). Selective electrical interconnects (34) are made between the structures.
Abstract:
A high temperature superconductor (HTS) tri-layer structure (20) and a method for providing the same are described. Preferably two dimensional growth for all layers is provided resulting in smooth surfaces and highly crystalline layers. Full oxygenation of HTS under-layer(s) (24) is provided despite having thick intervening dielectric mid-layer (26). HTS over- and under-layers (28, 24) are preferably structurally and electrically similar and have high crystallinity, the HTS layers have high Tc (e.g. > 90 K) comparable to Tc of single layer superconductor layers and a high Jc (e.g. > 1,000,000 A/(cm x cm)), the tri-layer properties do not significantly degrade as the thickness of the layers is increased, and the dielectric mid-layer (26) has high resistivity and is substantially pin-hole free. The HTS tri-layer structure (20) of the present invention is achieved by using a capping-layer (25) to protect the HTS under-layer (24), by conducting an oxygen anneal to fully oxygenate the HTS layers, and/or by thermally matching the substrate (22) to the other layers (e.g. by using buffer layers (23) to overcome lattice mismatch problems). The present invention also provides an improved HTS capacitor having low loss at microwave frequencies and having a smaller size and/or greater capacitance per area unit when compared to conventional HTS capacitors.
Abstract:
In a stripline transmission system (fig. 1), a center conductor (12) having edges (14) is disposed between generally planar, substantially parallel ground planes (16, 18). A first dielectric (22) supports the center conductor (12) which is disposed between the first and second ground planes (16, 18). Gap portions (20) are formed adjacent the center conductor edges (14), the gap (20) containing a dielectric having a dielectric constant lower than that of the solid dielectric (22). The dielectric in the gap (20) is preferably air or vacuum. In one embodiment (fig. 2), the gap portion (42) extends in the region laterally exterior to the center conductor edges (32) and between the ground planes (34, 36). In a microstrip embodiment (50 in fig. 3), a substrate (52) has substantially parallel first and second faces (54, 56), the first face (54) bearing a center conductor (58) having edges (64) with adjacent troughs (62) formed into the first face (54), and a ground plane (60) on the second face (56). Reduced losses and improved linearity results, thereby providing applications for components such as filters, receivers and transmitters.