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    COATED AND MAGNETIC PARTICLES AND APPLICATIONS THEREOF
    1.
    发明专利
    COATED AND MAGNETIC PARTICLES AND APPLICATIONS THEREOF 未知

    公开(公告)号：AU2003298904A1

    公开(公告)日：2004-06-30

    申请号：AU2003298904

    申请日：2003-12-05

    Applicant: SURFECT TECHNOLOGIES INC

    Inventor： GRIEGO THOMAS P

    IPC: B23K35/02 ,  C25D7/12 ,  C25D17/16 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/288 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H05K3/34

    Abstract: A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For solder joints, after reflow the solder material may comprise unmelted particles in a matrix, thereby increasing the strength of the joint and decreasing the pitch of an array of joints. The particle and coating may form a higher melting point alloy, permitting multiple subsequent reflow steps. The particles and/or the coating may be magnetic. External magnetic fields may be applied during deposition to precisely control the particle loading and deposition location. Elements with incompatible electropotentials may thereby be electrodeposited in a single step. Using such fields permits the fill of high aspect ratio structures such as vias without requiring complete seed metallization of the structure. Also, a catalyst consisting of a magnetic particle coated with a catalytic material, optionally including an intermediate layer.

    Coated and magnetic particles and applications thereof
    2.
    发明专利
    Coated and magnetic particles and applications thereof 未知

    公开(公告)号：AU2003298904A8

    公开(公告)日：2004-06-30

    申请号：AU2003298904

    申请日：2003-12-05

    Applicant: SURFECT TECHNOLOGIES INC

    Inventor： GRIEGO THOMAS P

    IPC: B23K35/02 ,  C25D7/12 ,  C25D17/16 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/288 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H05K3/34 ,  C25B11/04

    Abstract: A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For solder joints, after reflow the solder material may comprise unmelted particles in a matrix, thereby increasing the strength of the joint and decreasing the pitch of an array of joints. The particle and coating may form a higher melting point alloy, permitting multiple subsequent reflow steps. The particles and/or the coating may be magnetic. External magnetic fields may be applied during deposition to precisely control the particle loading and deposition location. Elements with incompatible electropotentials may thereby be electrodeposited in a single step. Using such fields permits the fill of high aspect ratio structures such as vias without requiring complete seed metallization of the structure. Also, a catalyst consisting of a magnetic particle coated with a catalytic material, optionally including an intermediate layer.

    APPARATUS AND METHOD FOR HIGHLY CONTROLLED ELECTRODEPOSITION
    4.
    发明申请
    APPARATUS AND METHOD FOR HIGHLY CONTROLLED ELECTRODEPOSITION 审中-公开
    用于高度控制电沉积的装置和方法

    公开(公告)号：WO2004072331A3

    公开(公告)日：2004-10-28

    申请号：PCT/US2004004277

    申请日：2004-02-12

    Applicant: SURFECT TECHNOLOGIES INC ,  GRIEGO THOMAS P ,  SANCHEZ FERNANDO M

    Inventor： GRIEGO THOMAS P ,  SANCHEZ FERNANDO M

    IPC: B23K35/02 ,  C25D7/12 ,  C25D17/16 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H05K3/34 ,  C25D5/00 ,  C25D17/00

    CPC classification number: B23K35/0244 ,  B22F2998/00 ,  B22F2999/00 ,  C25D15/00 ,  C25D15/02 ,  C25D17/001 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L2224/11334 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/014 ,  B22F1/025 ,  B22F1/0088

    Abstract: An apparatus and method for highly controlled electrodeposition, particularly useful for electroplating submicron structures. Enhanced control of the process provides for a more uniform deposit thickness over the entire substrate, and permits reliable plating of submicron features. The apparatus includes a pressurized electrochemical cell (10) to improve plating efficiency and reduce defects, vertical laminar flow of the electrolyte solution to remove surface gases from the vertically arranged substrate, a rotating wafer chuck (12) to eliminate edge plating effects, and a variable aperture (18) to control the current distribution and ensure deposit uniformity across the entire substrate. Also a dynamic profile anode whose shape can be varied to optimize the current distribution to the substrate. The anode is advantageously able to use metallic ion sources and may be placed close to the cathode thus minimizing contamination of the substrate.

    Abstract translation: 用于高度控制电沉积的装置和方法，特别适用于电镀亚微米结构。 该过程的增强控制提供了在整个基板上更均匀的沉积厚度，并且允许亚微米特征的可靠电镀。 该设备包括一个加压电化学电池（10），以提高电镀效率并减少缺陷，电解质溶液的垂直层流从垂直排列的衬底去除表面气体，旋转晶片吸盘（12）以消除边缘电镀效应，以及 可变孔径（18）以控制电流分布并确保整个基板上的沉积均匀性。 还可以改变其形状可以改变以优化对衬底的电流分布的动态轮廓阳极。 阳极有利地能够使用金属离子源并且可以靠近阴极放置，从而最小化衬底的污染。

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