公开(公告)号：JPH096498A

公开(公告)日：1997-01-10

申请号：JP14477396

申请日：1996-05-01

Applicant: SYMBIOS LOGIC INC

Inventor： BURAIAN II RAMUKIN ,  REIMONDO ESU ROUHAFU ,  KENESU JIEI TONPUSON

IPC: G06F1/18 ,  G06F3/00 ,  G06F13/40 ,  H01R29/00 ,  H01R31/00

Abstract: PROBLEM TO BE SOLVED: To provide a method and system for suitably and automatically terminating the mutual connection of various mutual connection systems to a bus. SOLUTION: A cable 12 connected to an adaptor card 10 can be automatically terminated. The existence of a device connected to such a cable 12 is detected. A terminal circuit is selectively started in accordance with a device connected to the card 10 and the terminating operation of the cable 12 is executed. In an embodiment, plural different types of devices having respectively different data length values are connected to a normal adapator card 10 through plural cables 12. These cables 12 regulate the the mutual connection of the devices to the card 10 based upon a bus protocol. A signal to be transmitted/received to/from the cable 12 is sourced/sunk from/into a controller chip. A terminal circuit adjacent to the controller chip 15 selectively started in accordance with the type of a device connected to a bus and termination is presented to the host side of the bus.

公开(公告)号：JPH08339838A

公开(公告)日：1996-12-24

申请号：JP13453596

申请日：1996-05-29

Applicant: SYMBIOS LOGIC INC

Inventor： BARII II KARUDOUERU ,  REIMONDO ESU ROUHAFU

IPC: H01R43/02 ,  H01R4/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To reduce bridges formed between a lead wire and an integrated circuit by arranging a solder pad having a curved side in a related fixing hole when the lead wire of the integrated circuit is soldered to the fixing hole of an electronic component by wave soldering. SOLUTION: A lead wire 14 of an electronic component 10 such as an integrated circuit is passed through each fixing hole 16 formed in a printed circuit board 12 and soldered. The fixing hole 16 of the printed circuit board 12 is surrounded by a plated solder pad 18 on at least the conductor side 20 of the printed circuit board 12, and the non-soldered surface of the printed circuit board 12 is protected with a mask 22. An arc-shaped polymorphic linear type gathering pad 24 having the specific R is arranged in the vicinity of each fixing hole 16. During soldering work, a soldering wave 26 is formed in a molten solder bath with a supporting plate 28, and the printed circuit board is passed through the soldering wave 26, the lead wire 14 comes in contact with the soldering wave 26, and the lead wire 14 is electrically connected to the plated solder pad 18 by soldering.