公开(公告)号：US12074152B2

公开(公告)日：2024-08-27

申请号：US17410053

申请日：2021-08-24

Applicant: Samsung Display Co., LTD.

Inventor： Dae Hyuk Im ,  Sun Oh Jeong ,  So Young Yeo ,  Hee Ju Woo

IPC: H01L25/18 ,  H01L21/66 ,  H01L23/00 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L25/18 ,  H01L22/32 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/32 ,  H01L24/83 ,  H05K1/0268 ,  H01L2224/06165 ,  H01L2224/32227 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83851 ,  H01L2224/83908 ,  H05K1/189 ,  H05K2201/10128 ,  H05K2201/10378

Abstract: A display device includes a display panel, a first film attached to the display panel, an adhesive member interposed between the display panel and the first film and extending in a first direction to attach the display panel to the first film, a first test electrode covered by the adhesive member; a second test electrode covered by the adhesive member and spaced apart from the first test electrode in a second direction perpendicular to the first direction, and test lines comprising a first test line electrically connected to the first test electrode and a second test line electrically connected to the second test electrode, where the adhesive member is disposed between the first test electrode and the second test electrode in the second direction.

公开(公告)号：US11770966B2

公开(公告)日：2023-09-26

申请号：US17956096

申请日：2022-09-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Eui Jeong Kang ,  Si Joon Song ,  Byoung Yong Kim ,  Dae Hyuk Im

IPC: H10K71/00 ,  H10K50/844 ,  H10K59/131 ,  H10K59/12

CPC classification number: H10K71/00 ,  H10K50/844 ,  H10K59/131 ,  H10K59/1201

Abstract: A method of manufacturing a display device includes: providing a first substrate, a second substrate, and a plurality of connection lines, wherein the first substrate has a base substrate, wherein the second substrate faces the first substrate, and wherein the plurality of connection lines are disposed between the base substrate and the second substrate; grinding a side surface of the base substrate, a side surface of the second substrate, and side surfaces of the plurality of connection lines; and simultaneously transferring a conductive film and laser-curing the conductive film, wherein the conductive film is transferred to the ground side surface of the base substrate, the ground side surface of the second substrate, and the ground side surfaces of the plurality of connection lines.

公开(公告)号：US11508946B2

公开(公告)日：2022-11-22

申请号：US16895360

申请日：2020-06-08

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Eui Jeong Kang ,  Si Joon Song ,  Byoung Yong Kim ,  Dae Hyuk Im

IPC: H01L51/56 ,  H01L51/52 ,  H01L27/32

Abstract: A method of manufacturing a display device includes: providing a first substrate, a second substrate, and a plurality of connection lines, wherein the first substrate has a base substrate, wherein the second substrate faces the first substrate, and wherein the plurality of connection lines are disposed between the base substrate and the second substrate; grinding a side surface of the base substrate, a side surface of the second substrate, and side surfaces of the plurality of connection lines; and simultaneously transferring a conductive film and laser-curing the conductive film, wherein the conductive film is transferred to the ground side surface of the base substrate, the ground side surface of the second substrate, and the ground side surfaces of the plurality of connection lines.

公开(公告)号：US11114774B2

公开(公告)日：2021-09-07

申请号：US16689240

申请日：2019-11-20

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dae Hyuk Im ,  Byoung Yong Kim

IPC: H01R4/04 ,  H05K1/18 ,  H01R43/00 ,  H05K3/32

Abstract: A display device includes a display panel. A flexible printed circuit board is electrically connected to the display panel. A first pad is disposed on the display panel. A second pad is disposed on the flexible printed circuit board and overlaps the first pad. A first anisotropic conductive film is disposed between the first pad and the second pad. The first anisotropic conductive film is configured to bond the first pad to the second pad. The first anisotropic conductive film includes a conductive polymer. The first anisotropic conductive film includes at least one first conductive region that electrically connects the first pad and the second pad and at least one first insulating region.

公开(公告)号：US11747871B2

公开(公告)日：2023-09-05

申请号：US17407460

申请日：2021-08-20

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dae Hyuk Im

IPC: H05K1/18 ,  G06F1/18 ,  H05K1/11

CPC classification number: G06F1/183 ,  G06F1/189 ,  H05K1/111 ,  H05K1/118 ,  H05K2201/10128

Abstract: A flexible printed circuit board and a display device including the same are provided. An embodiment of a display device includes a display panel; a first circuit board attached to a first side of the display panel in a first direction; and a second circuit board attached to a second side of the first circuit board in the first direction, wherein the first circuit board includes a first bump area overlapping the display panel and a second bump area overlapping the second circuit board, the first bump area includes a plurality of first divided board portions arranged along a second direction crossing the first direction, and the first divided board portions of the plurality of first divided board portions partially overlap each other.

公开(公告)号：US11106068B2

公开(公告)日：2021-08-31

申请号：US16897986

申请日：2020-06-10

Applicant: Samsung Display Co., LTD.

Inventor： Si Joon Song ,  Eui Jeong Kang ,  Byoung Yong Kim ,  Dae Hyuk Im ,  Young Min Park

IPC: G02F1/1333 ,  H05K13/08 ,  G02F1/1345 ,  G02F1/1335 ,  G02F1/13357

Abstract: A method of manufacturing a display device includes fixing a display panel to a stage, attaching a printed circuit board to a first side surface of the fixed display panel, and irradiating the first side surface of the display panel with light from a first lighting and irradiating a second side surface of the display panel opposite the first side surface of the display panel with light from a second lighting to check alignment of the printed circuit board.