公开(公告)号：US20240313166A1

公开(公告)日：2024-09-19

申请号：US18597759

申请日：2024-03-06

Applicant: Samsung Display Co., LTD.

Inventor： Hyung Rae CHA ,  Jun Youn KIM ,  Dong Uk KIM ,  Myeong Hee KIM ,  Seul Ki KIM ,  Hee Keun LEE

IPC: H01L33/40 ,  H01L25/16 ,  H01L33/20

CPC classification number: H01L33/405 ,  H01L25/167 ,  H01L33/20 ,  H01L2933/0016

Abstract: A light emitting element, a display device including the same and a method of fabricating the same. The light emitting element may include an element rod including a first semiconductor layer, an active layer, and a second semiconductor layer. First and second contact electrodes may be respectively disposed on a first end surface and a second and opposite end surface of the element rod. A reflection layer may surround the first contact electrode and the element rod. An inner insulating layer may be disposed inside the reflection layer and surround the first contact electrode and the element rod. An outer insulating layer external to the reflection layer and may surround the first contact electrode and the element rod. A first inclination of side surfaces of the first semiconductor layer and the active layer and a second inclination of a side surface of the second semiconductor layer may be different.

公开(公告)号：US20250143014A1

公开(公告)日：2025-05-01

申请号：US18742389

申请日：2024-06-13

Applicant: Samsung Display Co., LTD.

Inventor： Jun Bo SIM ,  Jun Youn KIM ,  Joo Woan CHO ,  Jin Taek PARK ,  So Young YEO ,  Dong Eon LEE ,  Jae Hoon JUNG

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for manufacturing a display device includes manufacturing an epitaxial wafer including an epitaxial thin film, dividing the epitaxial wafer into wafer dies having a size corresponding to an area of each cell area of a backplane substrate including cell areas, transferring the wafer dies to a carrier substrate, forming a conductive bonding layer on epitaxial dies of the wafer dies, disposing the carrier substrate on the backplane substrate such that the epitaxial dies are disposed in each cell area of the backplane substrate and bonding the epitaxial dies onto the backplane substrate, removing the carrier substrate from the epitaxial dies, and etching the epitaxial dies to form respective light emitting elements in emission areas included in each cell area of the backplane substrate.