公开(公告)号：KR20180065058A

公开(公告)日：2018-06-18

申请号：KR20160165113

申请日：2016-12-06

Applicant: SAMSUNG DISPLAY CO LTD

Inventor： EMIL ASLANOV ,  RYU JE KIL ,  LEE HAE SOOK ,  CHUNG KYUNG HOON ,  HAN GYOO WAN

IPC: B23K26/06 ,  B23K26/08 ,  B23K26/359 ,  B23K26/38 ,  B23K101/36

CPC classification number: G02B13/0005 ,  B23K26/0643 ,  G02B26/101 ,  G02B26/105 ,  G02B27/106

Abstract: 레이저가공장치가제공된다. 레이저가공장치는레이저빔을생성하는이저광원, 레이저빔의광 경로상에위치하며, 제1 방향또는제1 방향과다른제2 방향으로상기레이저빔의경로를조절하는스캐너부, 스캐너부에의해조절된레이저빔의광 경로상에위치하며, 상기레이저빔을반사하는반사부를포함하되, 반사부는제1 방향으로광 경로를이격시키는제1 서브반사부와제1 방향과반대되는제3 방향으로광 경로를이격시키는제2 서브반사부를포함한다.

公开(公告)号：US20220315481A1

公开(公告)日：2022-10-06

申请号：US17577846

申请日：2022-01-18

Applicant: Samsung Display Co., Ltd.

Inventor： CHEOLLAE ROH ,  VORONOV ALEXANDER ,  HYUNGSIK KIM ,  EMIL ASLANOV ,  SUNGGYU PARK ,  JOONGSUNG LEE ,  WOOHYUN JUNG

IPC: C03C15/00 ,  C03B33/02

Abstract: A window manufacturing method includes providing a mother substrate on a moving stage, the mother substrate including a cutting line; irradiating substantially simultaneously a first beam and a second beam to the mother substrate to cut the mother substrate and to form a target substrate; separating the target substrate from the mother substrate; and providing an etchant to the target substrate to chamfer the target substrate. The first beam is irradiated to the cutting line of the mother substrate, the second beam is irradiated to a point spaced apart from the cutting line of the mother substrate by a distance, and a pulse energy of the first beam is different from a pulse energy of the second beam.

公开(公告)号：US20250100926A1

公开(公告)日：2025-03-27

申请号：US18972327

申请日：2024-12-06

Applicant: Samsung Display Co., Ltd.

Inventor： CHEOLLAE ROH ,  VORONOV ALEXANDER ,  HYUNGSIK KIM ,  EMIL ASLANOV ,  SUNGGYU PARK ,  JOONGSUNG LEE ,  WOOHYUN JUNG

IPC: C03C15/00 ,  C03B33/02

Abstract: A window manufacturing method includes providing a mother substrate on a moving stage, the mother substrate including a cutting line; irradiating substantially simultaneously a first beam and a second beam to the mother substrate to cut the mother substrate and to form a target substrate; separating the target substrate from the mother substrate; and providing an etchant to the target substrate to chamfer the target substrate. The first beam is irradiated to the cutting line of the mother substrate, the second beam is irradiated to a point spaced apart from the cutting line of the mother substrate by a distance, and a pulse energy of the first beam is different from a pulse energy of the second beam.