公开(公告)号：US20150382461A1

公开(公告)日：2015-12-31

申请号：US14849122

申请日：2015-09-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hyung Gi HA ,  Jae Won JUNG ,  Yong Hwan KIM ,  Jong Jin LEE ,  Ja Ho KOO ,  Young Hwan SHIN ,  Dong Kyu LEE

IPC: H05K1/09

CPC classification number: H05K1/09 ,  H05K1/0284 ,  H05K1/11 ,  H05K3/383 ,  H05K3/385 ,  H05K3/462 ,  H05K2201/0195 ,  H05K2201/0239

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：具有用于电路的金属图案的基底基板; 以及设置在所述金属图案上的表面粗糙度，其中所述表面粗糙度在锚结构中具有第一表面粗糙度，以及在所述第一表面粗糙度上形成的针结构中具有黑色氧化物层的第二表面粗糙度。