公开(公告)号：WO2020036319A1

公开(公告)日：2020-02-20

申请号：PCT/KR2019/008619

申请日：2019-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  HYUPJINCONNECTOR CO., LTD

Inventor： CHO, Yonglak ,  PARK, Jeongki ,  KIM, Mihyun ,  LEE, Jeongyong ,  LEE, Choonggeun ,  CHUNG, Dongjin ,  HUR, Jangwon ,  LEE, Jiwoo

IPC: H04M1/02

Abstract: The disclosure includes a housing including a first plate, a second plate, and a side member surrounding a space between the first and second plates, a printed circuit board disposed in the space and including an opening, a first conductive structure disposed in the space, a second conductive structure disposed in the space, and a flexible conductive member located between the first and second conductive structures through the opening to construct an electrical path between the first and second conductive structures. The flexible conductive member may include a base, a first flexible portion having a first height from the base, protruding from the base toward the first plate, and in contact with the first conductive structure, and a second flexible portion having a second height from the base, protruding from the base toward the second plate, and in contact with the second conductive structure.

公开(公告)号：EP4376565A1

公开(公告)日：2024-05-29

申请号：EP22856177.5

申请日：2022-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： CHO, Yonglak ,  KIM, Joohan ,  KIM, Juho ,  PARK, Min ,  PARK, Eunsoo ,  AN, Insun ,  LEE, Byungwoo ,  LEE, Sangtae ,  LEE, Haejin

IPC: H05K7/20 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K7/20 ,  H05K1/11 ,  H05K3/46

Abstract: A circuit board module according to various embodiments of the present disclosure may comprise: a first substrate; a second substrate including a first opening and disposed over the first substrate; an interposer disposed between the first substrate and the second substrate to connect the first substrate and the second substrate and providing a first space between the first substrate and the second substrate; a sealing member attached to cover the first opening; and a filler disposed between the first substrate and the second substrate, wherein the sealing member includes an insertion area in which a filler insertion nozzle is inserted into the first opening, and a second opening through which air is introduced into the first space and a third opening through which air is discharged from the first space are formed through at least one of the first substrate, the second substrate, and the interposer.

公开(公告)号：EP4149105A1

公开(公告)日：2023-03-15

申请号：EP21822823.7

申请日：2021-05-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： KIM, Jeongsik ,  LEE, Muyeol ,  PARK, Eunsoo ,  CHO, Yonglak ,  LEE, Jiwoo

IPC: H04N5/225 ,  H01Q9/04 ,  H01Q1/24

Abstract: An electronic device according to various embodiments of the present disclosure may comprise: a housing; a camera module which is disposed in the housing and includes a first camera module comprising a first camera housing, a prism disposed in the first camera housing and configured to refract light, and an image sensor disposed in the first camera housing and configured to acquire the light through the camera window and the prism; and an antenna module which is at least partially disposed on the first camera module.

公开(公告)号：EP4007456A1

公开(公告)日：2022-06-01

申请号：EP20843330.0

申请日：2020-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： KWAK, Kyujin ,  PARK, Jinwoo ,  CHO, Yonglak ,  LEE, Jiwoo

IPC: H05K1/14 ,  H05K1/11 ,  H05K5/00 ,  H05K5/03 ,  H04M1/02

Abstract: According to various embodiments disclosed in the present document, an electronic device comprises: a housing comprising a first support member; a printed circuit board assembly arranged to face the first support member; a cover member coupled to the first support member to face each other, with a portion of the printed circuit board assembly therebetween; and a second support member coupled to the first support member to face each other, with another portion of the printed circuit board assembly therebetween, wherein the printed circuit board assembly comprises a first printed circuit board comprising a first portion arranged between the cover member and the first support member and a second portion arranged between the second support member and the first support member, a second printed circuit board arranged to at least face the first portion and arranged between the first printed circuit board and the cover member, and an interposer board arranged to correspond to at least a portion of the edge of the second printed circuit board to thereby couple the second printed circuit board to the first printed circuit board, wherein the second support member may bias a portion of the edge of the second printed circuit board. Various other embodiments are also possible.