公开(公告)号：US20250157867A1

公开(公告)日：2025-05-15

申请号：US18883053

申请日：2024-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongkook KIM ,  Heungkyu KWON ,  Youngchul KIM ,  Choonheung LEE ,  Donghyun CHA ,  Junghwa KIM ,  Junso PAK ,  Kyounghoon LEE ,  Jaegwon JANG ,  Hangchul CHOI ,  Heejung CHOI ,  Kyojin HWANG

IPC: H01L23/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L25/18 ,  H05K1/18 ,  H10B80/00

Abstract: A semiconductor package that includes an upper package including a first package substrate, a first semiconductor chip mounted on the first package substrate, and a first molding layer surrounding the first semiconductor chip; a printed circuit board (PCB) on which the upper package is mounted in a central region; and a stiffener positioned on a top surface of the PCB and including an opening. A top surface of the PCB contacts a bottom surface of the stiffener in at least part of edge regions of the PCB. In the central region of the PCB and in edge regions other than the at least part of edge regions of the PCB, a top surface of the PCB is apart from the bottom surface of the stiffener in a vertical direction, and the opening of the stiffener overlaps the upper package in the vertical direction.