公开(公告)号：US20250159844A1

公开(公告)日：2025-05-15

申请号：US18946026

申请日：2024-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Boram KIM ,  Ohhyuck KWON ,  Youngjin KIM ,  Min PARK ,  Jungoh SUNG ,  Changjong SON ,  Yoonhee CHANG ,  Jinhwan JUNG ,  Jieun HWANG ,  Jihyeon SON ,  Jeonggen YOON

IPC: H05K7/20 ,  H05K9/00

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may comprise: a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component mounted in a first area of a surface of the first electronic component, and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component. The heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.

公开(公告)号：US20210251110A1

公开(公告)日：2021-08-12

申请号：US17166248

申请日：2021-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haejin LEE ,  Dongku KANG ,  Jihong KIM ,  Min PARK ,  Yunjeong PARK ,  Kyuhwan LEE ,  Jinhwan JUNG ,  Ahreum HWANG ,  Kyungha KOO

IPC: H05K9/00 ,  H05K1/02

Abstract: A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.

公开(公告)号：US20220173500A1

公开(公告)日：2022-06-02

申请号：US17457989

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haejin LEE ,  Min PARK ,  Jinhwan JUNG

IPC: H01Q1/24 ,  H01Q1/52 ,  H01Q1/02

Abstract: According to various embodiments, an electronic device includes: a housing including a conductive part; an antenna module, including a substrate including a first substrate surface, a second substrate surface facing a direction opposite a direction of the first substrate surface, and a substrate side surrounding a space between the first substrate surface and the second substrate surface, at least one antenna element disposed in the substrate, wireless communication circuitry disposed in the substrate and configured to transmit and/or receive a radio signal in the direction toward which the first substrate surface is directed through the at least one antenna element, a protection member disposed on the second substrate surface, and a conductive shield layer disposed on at least an external surface of the protection member, as an antenna module disposed in an internal space of the housing; a conductive member disposed in at least a part of the conductive part and having at least a partial area thereof facing at least a part of the conductive shield layer; and a noise induction layer disposed between the antenna module and the conductive member to form a capacitor structure having a specified capacitance value between the conductive shield layer and the conductive member. Noise induced from the antenna module may be induced toward the conductive part through the capacitor structure.