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    METHOD AND APPARATUS FOR MANAGING DEVICE USING AT LEAST ONE SENSOR
    2.
    发明申请
    METHOD AND APPARATUS FOR MANAGING DEVICE USING AT LEAST ONE SENSOR 审中-公开
    使用至少一个传感器管理设备的方法和设备

    公开(公告)号：WO2017095208A1

    公开(公告)日：2017-06-08

    申请号：PCT/KR2016/014194

    申请日：2016-12-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： MIN, Hyunsuk ,  KIM, Jieun ,  LIM, Yunjae ,  LEE, Changseok ,  CHOI, Sangsun ,  KANG, Jaeeun ,  KO, Junho ,  RYU, Jongyoub ,  LIM, Yonghyun

    IPC: H04L12/28 ,  H04L29/08 ,  H04L12/24 ,  H04L12/26

    CPC classification number: H04W24/08 ,  H04W4/02 ,  H04W4/70 ,  H04W84/18

    Abstract: The present disclosure relates to a sensor network, Machine Type Communication (MTC), Machine-to-Machine (M2M) communication, and technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the above technologies, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A method of managing an electronic device is provided, which includes determining a management target device, selecting at least one measurement device based on the determined management target device, transmitting an operation command to the management target device, receiving measurement information from the at least one measurement device, and determining a state of the management target device based on the received measurement information.

    Abstract translation: 本公开涉及传感器网络，机器类型通信（MTC），机器对机器（M2M）通信以及物联网技术（IoT）。 本发明可以应用于智能家居，智能建筑，智慧城市，智能汽车，联网汽车，医疗保健，数字教育，智能零售，安全和安全服务等基于上述技术的智能服务。 提供了一种管理电子设备的方法，该方法包括：确定管理目标设备;基于确定的管理目标设备选择至少一个测量设备;向管理目标设备发送操作命令;从至少一个管理目标设备接收测量信息 测量设备，并且基于接收到的测量信息来确定管理目标设备的状态。

    MULTILAYER STRUCTURE INCLUDING DIFFUSION BARRIER LAYER AND DEVICE INCLUDING THE MULTILAYER STRUCTURE
    8.
    发明公开
    MULTILAYER STRUCTURE INCLUDING DIFFUSION BARRIER LAYER AND DEVICE INCLUDING THE MULTILAYER STRUCTURE 审中-公开
    与扩散阻挡层和设备符合这种多层结构的多层结构

    公开(公告)号：EP3125291A1

    公开(公告)日：2017-02-01

    申请号：EP16176425.3

    申请日：2016-06-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： SONG, Hyunjae ,  NAM, Seunggeol ,  PARK, Seongjun ,  SHIN, Keunwook ,  SHIN, Hyeonjin ,  LEE, Jaeho ,  LEE, Changseok ,  CHO, Yeonchoo

    IPC: H01L23/532 ,  H01L21/768 ,  H01L23/485

    CPC classification number: H01L21/76846 ,  H01L21/28525 ,  H01L21/28568 ,  H01L23/485 ,  H01L23/53209 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/53271 ,  H01L29/45

    Abstract: A multilayer structure includes a first material layer (L10), a second material layer (L20), and a diffusion barrier layer (B10). The second material layer is connected to the first material layer. The second material layer is spaced apart from the first material layer. The diffusion barrier layer is between the first material layer and the second material layer. The diffusion barrier layer may include a two-dimensional (2D) material. The 2D material may be a non-graphene-based material, such as a metal chalcogenide-based material having a 2D crystal structure. The first material layer may be a semiconductor or an insulator, and the second material layer may be a conductor. At least a part of the multilayer structure may constitute an interconnection for an electronic device.

    Abstract translation: 一种多层结构，包括第一材料层（L10），第二材料层（L20），和扩散阻挡层（B10）。 第二材料层被连接到所述第一材料层。 所述第二材料层是由第一材料层隔开。 扩散阻挡层位于所述第一材料层和第二材料层之间。 扩散阻挡层可以包括一个二维（2D）的材料。 二维材料可以是基于非石墨烯材料，颜色：如具有二维晶体结构的基于硫族化物的金属材料。 第一材料层可以是半导体或绝缘体上，并且所述第二材料层可以是导体。 至少所述多层结构的一部分可以在电子设备上构成为互连。

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