公开(公告)号：US20210153300A1

公开(公告)日：2021-05-20

申请号：US17137969

申请日：2020-12-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhong KIM ,  Seyun KIM ,  Haengdeog KOH ,  Doyoon KIM ,  Hajin KIM ,  Soichiro MIZUSAKI ,  Minjong BAE ,  Changsoo LEE

IPC: H05B1/02 ,  H05B3/26

Abstract: Provided are a structure, a planar heater including the same, a heating device including the planar heater, and a method of preparing the structure. The structure includes a metal substrate, an insulating layer disposed on the metal substrate, an electrode layer disposed on the insulating layer, and an electrically conductive layer disposed on the electrode layer, wherein a difference in a coefficient of thermal expansion (CTE) between the metal substrate and the insulating layer is 4 parts per million per degree Kelvin change in temperature (ppm/K) or less.

公开(公告)号：US20190037644A1

公开(公告)日：2019-01-31

申请号：US16045834

申请日：2018-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhong KIM ,  Seyun KIM ,  Haengdeog KOH ,  Doyoon KIM ,  Hajin KIM ,  Soichiro MIZUSAKI ,  Minjong BAE ,  Changsoo LEE

IPC: H05B1/02

Abstract: Provided are a structure, a planar heater including the same, a heating device including the planar heater, and a method of preparing the structure. The structure includes a metal substrate, an insulating layer disposed on the metal substrate, an electrode layer disposed on the insulating layer, and an electrically conductive layer disposed on the electrode layer, wherein a difference in a coefficient of thermal expansion (CTE) between the metal substrate and the insulating layer is 4 parts per million per degree Kelvin change in temperature (ppm/K) or less.

公开(公告)号：US20190037645A1

公开(公告)日：2019-01-31

申请号：US15868451

申请日：2018-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seyun KIM ,  Jinhong KIM ,  Haengdeog KOH ,  Doyoon KIM ,  Hajin KIM ,  Soichiro MIZUSAKI ,  Minjong BAE ,  Changsoo LEE

IPC: H05B3/14 ,  H05B3/26 ,  H01C17/06 ,  H01C17/30 ,  C03C3/064 ,  C03C4/16

CPC classification number: H05B3/141 ,  C03C3/064 ,  C03C4/16 ,  H01C17/06 ,  H01C17/30 ,  H05B3/262

Abstract: A The heating element structure includes: a conductive metal substrate; a heating layer spaced apart from the conductive metal substrate and configured to generate heat in response to an electrical signal; electrodes in contact with the heating layer and configured to provide the electrical signal to the heating layer; and a first insulating layer on the conductive metal substrate, the first insulating layer comprising a first matrix material and a particle, wherein a difference between a coefficient of thermal expansion (CTE) of the first matrix material and a coefficient of thermal expansion of the particle is about 4×10−6 per Kelvin or less.

公开(公告)号：US20180077755A1

公开(公告)日：2018-03-15

申请号：US15680830

申请日：2017-08-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seyun KIM ,  Haengdeog KOH ,  Doyoon KIM ,  Jinhong KIM ,  Hajin KIM ,  Soichiro MIZUSAKI ,  Minjong BAE ,  Hiesang SOHN ,  Changsoo LEE

IPC: H05B3/12 ,  H05B3/14 ,  H05B3/26

CPC classification number: H05B3/12 ,  H05B3/141 ,  H05B3/146 ,  H05B3/148 ,  H05B3/26 ,  H05B3/262 ,  H05B3/265 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2214/04

Abstract: A heating element includes a matrix; and a plurality of conductive fillers, wherein some of the plurality of conductive fillers include first nano-sheets and first metal media configured to reduce a contact resistance between the first nano-sheets.

公开(公告)号：US20200337119A1

公开(公告)日：2020-10-22

申请号：US16919792

申请日：2020-07-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hiesang SOHN ,  Seyun KIM ,  Haengdeog KOH ,  Doyoon KIM ,  Soichiro MIZUSAKI ,  Jinhong KIM ,  Hajin KIM ,  Minjong BAE ,  Changsoo LEE

IPC: H05B1/02 ,  H05B3/14 ,  B29C70/88 ,  C03C14/00 ,  B29C70/02 ,  C03C4/14 ,  C03C17/00 ,  C03C8/16 ,  C03C8/14 ,  H05B3/26

Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.

公开(公告)号：US20190110337A1

公开(公告)日：2019-04-11

申请号：US16145753

申请日：2018-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haengdeog KOH ,  Hajin KIM ,  Minjong BAE ,  Doyoon KIM ,  Seyun KIM ,  Jinhong KIM ,  Soichiro MIZUSAKI ,  Changsoo Lee

IPC: H05B3/14 ,  C08K9/04 ,  C08K7/00 ,  C08K3/40 ,  C08K9/06 ,  H01B1/14

Abstract: A composition for forming a heating element; a dried and sintered product thereof; and a method of preparing the composition for forming a heating element, the composition including a matrix particle, a composite filler, and a solvent, wherein the composite filler includes a core and a coating layer disposed on the core, the core includes a nanosheet filler, and the composition has a pH in a range of about 5 to about 9.

公开(公告)号：US20180103509A1

公开(公告)日：2018-04-12

申请号：US15452171

申请日：2017-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoon KIM ,  Changsoo LEE ,  Haengdeog KOH ,  Seyun KIM ,  Jinhong KIM ,  Hajin KIM ,  Soichiro MIZUSAKI ,  Minjong BAE ,  Hiesang SOHN

IPC: H05B3/20 ,  F24C7/06 ,  H05B3/14

CPC classification number: H05B3/20 ,  F24C7/06 ,  H05B3/141 ,  H05B3/146 ,  H05B2203/007 ,  H05B2203/011

Abstract: The electric oven includes a case having a tubular shape with an open front face and accommodates food therein, an inner frame in the case, which has a plurality of external surfaces and defining a cavity which is a heating region of the food, a plurality of sheet heaters arranged on the external surfaces of the inner frame, and first and second electrodes connected to opposite edges of each of the sheet heaters, respectively. A plurality of thermal diffusion layers is disposed on corners of the external surfaces of the inner frame.