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公开(公告)号:US20200267293A1
公开(公告)日:2020-08-20
申请号:US16731497
申请日:2019-12-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Daeyoung NOH , Sangmin KIM , Minchang SHIM , Sunghyup LEE , Seunghoon LEE , Minjong LIM , Heeseok JUNG , Daehyeong PARK
Abstract: According to various embodiments, an electronic device includes a front plate, a display visible from outside the electronic device through at least a portion of the front plate and is disposed in an internal space of the electronic device, the display including a plurality of layers, and a first opening, an image sensor disposed in the internal space and to be visible through the first opening, and an adhesive layer including a second opening overlapping the first opening between the front plate and the display, the second opening being smaller than the first opening wherein an edge of the first opening is not visible when the display is viewed from above.
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公开(公告)号:US20250151216A1
公开(公告)日:2025-05-08
申请号:US19018849
申请日:2025-01-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dooryong KIM , Sungkyu HWANG , Minjong LIM
Abstract: An electronic device according to an embodiment of the disclosure may include a first housing, a second housing, and a hinge apparatus configured to foldably connect the first housing and the second housing to each other. The hinge apparatus may include a bracket including a first coupling portion and a second coupling portion spaced apart from the first coupling portion, a first rotator including a first rotating portion fastened to the first coupling portion of the bracket to rotate relative to the bracket, a second rotator including a second rotating portion fastened to the second coupling portion of the bracket to rotate relative to the bracket, and a damper disposed on at least one of the first coupling portion and the second coupling portion to come into contact with at least one of the first rotating portion and the second rotating portion depending on a degree of rotation of the first rotator and the second rotator relative to the bracket.
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公开(公告)号:US20210132728A1
公开(公告)日:2021-05-06
申请号:US17091174
申请日:2020-11-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yongho HWANG , Sanghyeon KIM , Soogyu LEE , Minjong LIM , Jinwan AN , Jiwoo LEE
Abstract: The disclosure relates to an electronic device comprises a frame forming a side surface of the electronic device; at least one opening formed on a certain region of the side surface; a thermoplastic member positioned on a region of an inner surface of the frame structure adjacent to the opening to fill at least a portion of the opening; and a sensor attached to an inner surface of the thermoplastic member and electrically connected with a processor.
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