公开(公告)号：US20190131030A1

公开(公告)日：2019-05-02

申请号：US16162488

申请日：2018-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongjin YUN ,  Seyun KIM ,  Minsu SEOL ,  Changseok LEE ,  Seongheon KIM ,  Hyangsook LEE ,  Changhoon JUNG

IPC: H01B1/24 ,  C08L65/00 ,  C08L25/18 ,  C08K3/04 ,  H01L51/10 ,  H01L51/44 ,  H01L51/52

Abstract: Provided are a conductive composite structure for an electronic device, a method of preparing the conductive composite structure, an electrode for an electronic device including the conductive composite structure, and an electronic device including the conductive composite structure. The conductive composite structure may contain graphene and an organic composite layer including a conductive polymer having a work function of about 5.3 eV or lower, and has a sheet resistance deviation of about 10% or less.