SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

    公开(公告)号:US20240130138A1

    公开(公告)日:2024-04-18

    申请号:US18483907

    申请日:2023-10-10

    CPC classification number: H10B51/30 H10B51/20 H10B51/40

    Abstract: A semiconductor memory device includes a cell substrate, a plurality of gate electrodes sequentially stacked on the cell substrate and extending in a first direction, first and second channel structures extending in a second direction different from the first direction and penetrating the plurality of gate electrodes, and a bit line disposed on the plurality of gate electrodes. The first and second channel structures each include a ferroelectric layer, a channel layer, a gate insulating layer and a back gate electrode, which are sequentially disposed on side walls of the plurality of gate electrodes. The first channel structure and the second channel structure are adjacent to each other in the first direction and share a bit line.

    SEMICONDUCTOR MEMORY DEVICE
    2.
    发明申请

    公开(公告)号:US20220139948A1

    公开(公告)日:2022-05-05

    申请号:US17377848

    申请日:2021-07-16

    Abstract: A semiconductor memory device having improved electrical characteristics is provided. The semiconductor memory device comprises a first semiconductor pattern separated from a substrate in a first direction, a first gate structure extending in the first direction and penetrating the first semiconductor pattern, a first conductive connecting line connected to the first semiconductor pattern and extending in a second direction different from the first direction, and a second conductive connecting line connected to the first semiconductor pattern. The first gate structure is between the first conductive connecting line and the second conductive connecting line, the first gate structure includes a first gate electrode and a first gate insulating film, and the first gate insulating film includes a first charge holding film contacting with the first semiconductor pattern.

    MOBILE TERMINAL AND OBJECT CHANGE SUPPORT METHOD FOR THE SAME

    公开(公告)号:US20180356955A1

    公开(公告)日:2018-12-13

    申请号:US16104704

    申请日:2018-08-17

    Abstract: A mobile terminal and a method of supporting an object change for the same are provided. The mobile terminal includes a display unit for outputting at least one object, and a control unit for controlling at least one of directly displaying, in response to a signal for changing the output object into a second object having a similar function but being of a different type than the output object, the second object on the display unit without a screen transition, and for outputting, in response to a signal for changing the output object into a second object having a similar function but being of a different type than the output object, a guide frame on the display unit so as to facilitate change of the output object without a screen transition.

    SEMICONDUCTOR MEMORY DEVICE
    5.
    发明公开

    公开(公告)号:US20240357810A1

    公开(公告)日:2024-10-24

    申请号:US18757708

    申请日:2024-06-28

    CPC classification number: H10B43/20 H10B43/10

    Abstract: A semiconductor memory device having improved electrical characteristics is provided. The semiconductor memory device comprises a first semiconductor pattern separated from a substrate in a first direction, a first gate structure extending in the first direction and penetrating the first semiconductor pattern, a first conductive connecting line connected to the first semiconductor pattern and extending in a second direction different from the first direction, and a second conductive connecting line connected to the first semiconductor pattern. The first gate structure is between the first conductive connecting line and the second conductive connecting line, the first gate structure includes a first gate electrode and a first gate insulating film, and the first gate insulating film includes a first charge holding film contacting with the first semiconductor pattern.

    RESISTIVE MEMORY DEVICE
    6.
    发明公开

    公开(公告)号:US20230397443A1

    公开(公告)日:2023-12-07

    申请号:US18111921

    申请日:2023-02-21

    Abstract: A resistive memory device includes: a substrate; a plurality of row lines extending in a first direction and spaced apart from each other in a second direction and a third direction, on the substrate, wherein the first direction, the second direction, and the third direction intersect each other; a plurality of column lines extending in the second direction and spaced apart from each other in the first direction, on the substrate; a plurality of upper selection lines extending in the second direction, between the row lines and the column lines; a channel layer extending in the third direction and connected to the plurality of row lines; and a first impurity region and a second impurity region spaced apart from each other in the third direction with the upper selection line interposed therebetween.

    SEMICONDUCTOR DEVICE
    7.
    发明申请

    公开(公告)号:US20210249397A1

    公开(公告)日:2021-08-12

    申请号:US17245299

    申请日:2021-04-30

    Abstract: A semiconductor device includes a first semiconductor structure including circuit devices and first bonding pads; and a second semiconductor structure connected to the first semiconductor structure, the second semiconductor structure including a base layer; a first memory cell structure including first gate electrodes and first channels penetrating through the first gate electrodes; a second memory cell structure including second gate electrodes and second channels penetrating through the second gate electrodes; bit lines between the first and the second memory cell structures, and electrically connected to the first and second channels in common; first and second conductive layers on the second surface of the base layer; a pad insulating layer having an opening exposing a portion of the second conductive layer; and second bonding pads disposed to correspond to the first bonding pads in a lower portion of the second memory cell structure.

    SEMICONDUCTOR DEVICE INCLUDING DATA STORAGE STRUCTURE

    公开(公告)号:US20210074914A1

    公开(公告)日:2021-03-11

    申请号:US16592041

    申请日:2019-10-03

    Abstract: A semiconductor device includes a stack structure on a substrate, the stack structure including alternating gate electrodes and insulating layers stacked along a first direction, a vertical opening through the stack structure along the first direction, the vertical opening including a channel structure having a semiconductor layer on an inner sidewall of the vertical opening, and a variable resistive material on the semiconductor layer, a vacancy concentration in the variable resistive material varies along its width to have a higher concentration closer to a center of the channel structure than to the semiconductor layer, and an impurity region on the substrate, the semiconductor layer contacting the impurity region at a bottom of the channel structure.

    SEMICONDUCTOR DEVICE
    9.
    发明申请

    公开(公告)号:US20190259439A1

    公开(公告)日:2019-08-22

    申请号:US16405219

    申请日:2019-05-07

    Abstract: A semiconductor device includes a memory cell region including memory cells arranged along channel holes, the channel holes being provided on a substrate to extend in a direction perpendicular to an upper surface of the substrate, and a peripheral circuit region disposed outside of the memory cell region and including low voltage transistors and high voltage transistors. The low voltage transistors include first transistors including a first gate dielectric layer and a first gate electrode layer including a metal, and the high voltage transistors include second transistors including a second gate dielectric layer having a dielectric constant lower than a dielectric constant of the first gate dielectric layer, and a second gate electrode layer including polysilicon.

    MEMORY DEVICE
    10.
    发明申请
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20180374540A1

    公开(公告)日:2018-12-27

    申请号:US15881208

    申请日:2018-01-26

    Abstract: A memory device includes a memory cell array including a first switch cell, a second switch cell, and a plurality of memory cells disposed between the first the second switch cells and connected to a plurality of word lines, and a control circuit configured to perform a program operation by providing a program voltage to a first word line among the plurality of word lines, a switch voltage to a second word line among the plurality of word lines, and a pass voltage to remaining word lines among the plurality of word lines, wherein the control circuit is configured to turn off the first switch cell and the second switch cell in a first section of the program operation, and configured to turn on the first switch cell and increase the switch voltage in a second section of the program operation later than the first section.

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