公开(公告)号：WO2020014597A2

公开(公告)日：2020-01-16

申请号：PCT/US2019/041576

申请日：2019-07-12

Applicant: SAMTEC, INC.

Inventor： BUCK, Jonathan E. ,  SASAKI, Yasuo ,  FERRY, Julian ,  GORE, Brandon Thomas

IPC: H01R13/6581 ,  H01R13/03

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：WO2020014597A3

公开(公告)日：2020-01-16

申请号：PCT/US2019/041576

申请日：2019-07-12

Applicant: SAMTEC, INC.

Inventor： BUCK, Jonathan E. ,  SASAKI, Yasuo ,  FERRY, Julian ,  GORE, Brandon Thomas

IPC: H01R13/6581 ,  H01R13/03

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：WO2022212604A1

公开(公告)日：2022-10-06

申请号：PCT/US2022/022686

申请日：2022-03-30

Applicant: SAMTEC, INC.

Inventor： CORONATI, John ,  EPITAUX, Marc ,  GORE, Brandon Thomas

IPC: H01L23/00

Abstract: An interconnection system includes a mating substrate that is configured to be placed in electrical communication with a main board along an insertion direction so as to define a separable interface. The interconnection system is configured to align the mating substrate with the main board along first and second transverse directions that are perpendicular to each other and to the insertion direction.

公开(公告)号：EP3821502A2

公开(公告)日：2021-05-19

申请号：EP19833417.9

申请日：2019-07-12

Applicant: Samtec Inc.

Inventor： BUCK, Jonathan E. ,  SASAKI, Yasuo ,  FERRY, Julian ,  GORE, Brandon Thomas

IPC: H01R13/6581 ,  H01R13/03