公开(公告)号：US09288905B2

公开(公告)日：2016-03-15

申请号：US14076667

申请日：2013-11-11

Applicant: Seagate Technology LLC

Inventor： Prapan Aparimarn ,  Chaovalit Chiyatan ,  Piriyakorn Jirawattanakasem ,  Joompondej Bamrungwongtaree

IPC: H05K1/00 ,  H05K1/11 ,  G11B5/48 ,  H05K1/05 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/111 ,  G11B5/486 ,  H05K1/0296 ,  H05K1/056 ,  H05K1/11 ,  H05K3/3436 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09727 ,  Y02P70/611

Abstract: A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with a uniform distance that separates a first internal lead from an adjacent second internal lead.

Abstract translation: 印刷电路基板可以配置有至少一个设计和成形以减少焊料桥接的内部引线。 印刷电路基板可以具有多个内部引线，每个内部引线具有限定隔离通道的连续曲线边界。 隔离通道可以配置有将第一内部引线与相邻的第二内部引线分开的均匀距离。

公开(公告)号：US20150129284A1

公开(公告)日：2015-05-14

申请号：US14076667

申请日：2013-11-11

Applicant: Seagate Technology LLC

Inventor： Prapan Aparimarn ,  Chaovalit Chiyatan ,  Piriyakorn Jirawattanakasem ,  Joompondej Bamrungwongtaree

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/111 ,  G11B5/486 ,  H05K1/0296 ,  H05K1/056 ,  H05K1/11 ,  H05K3/3436 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09727 ,  Y02P70/611

Abstract: A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with a uniform distance that separates a first internal lead from an adjacent second internal lead.

Abstract translation: 印刷电路基板可以配置有至少一个设计和成形以减少焊料桥接的内部引线。 印刷电路基板可以具有多个内部引线，每个内部引线具有限定隔离通道的连续曲线边界。 隔离通道可以配置有将第一内部引线与相邻的第二内部引线分开的均匀距离。