公开(公告)号：US10689286B2

公开(公告)日：2020-06-23

申请号：US15867574

申请日：2018-01-10

Applicant: Seagate Technology LLC

Inventor： David Marcus Tung ,  Donald E. Curtiss ,  Henry Luis Lott ,  Valeriu Rusu ,  Mitchell Tomio Inouye ,  Gabriel V. Sapinoso ,  Joachim Walter Ahner

IPC: C03B33/04 ,  C03B33/09

Abstract: A method includes cutting an outer diameter into a glass substrate. An inner diameter within the outer diameter is also cut into the glass substrate. A first region inside the outer diameter and a second region inside the inner diameter are heated. The second region inside the inner diameter is cooled, wherein the cooling causes the second region to detach from the first region.