公开(公告)号：US20240186947A1

公开(公告)日：2024-06-06

申请号：US18527212

申请日：2023-12-01

Applicant: SiTime Corporation

Inventor： Carl Martin Arft ,  Sassan Tabatabaei Zavareh ,  Aaron Partridge ,  Yushu Ma ,  Markus Rudolf Lutz ,  Li Ko Chiu

IPC: H03B5/04 ,  H03B5/30

CPC classification number: H03B5/04 ,  H03B5/30

Abstract: A microelectromechanical system (MEMS) device is provided with partitioning for thermal management. In one illustrative embodiment, the device may include: a heated section including a first die and a second die, wherein: the first die includes a heater, and the second die is coupled to the first die and includes a temperature sensor and a MEMS resonator; and a non-heated section communicatively coupled to the heated section and including a third die. The third die may receive a first signal associated with the temperature sensor and provides a second signal to the first die associated with the heater based on the first signal.