公开(公告)号：US20210005529A1

公开(公告)日：2021-01-07

申请号：US16958067

申请日：2018-11-19

Applicant: Siemens Aktiengesellschaft

Inventor： STEFAN PFEFFERLEIN ,  THOMAS BIGL ,  EWGENIJ OCHS

IPC: H01L23/367 ,  H05K7/20 ,  H01L21/48 ,  H01L23/498

Abstract: A semiconductor assembly includes a semiconductor element having contacts on a first surface electrically connected with contacts of a carrier element by electrically conductive material. A second surface opposite the first surface has a convex curvature with a first radius or a concave curvature with a second radius. The second surface of the convex curvature or the second surface of the concave curvature is connected in a positive-fit manner to a cooling body surface of a concave cooling body curvature of the cooling body, and, during operation at a selected barrier layer temperature, the first radius of the convex curvature deviates by at most 10% from a third radius of the concave cooling body curvature, or the second radius of the concave curvature deviates by at most 10% from a fourth radius of the convex cooling body curvature.

公开(公告)号：US20200275574A1

公开(公告)日：2020-08-27

申请号：US16649644

申请日：2018-09-28

Applicant: Siemens Aktiengesellschaft

Inventor： STEFAN PFEFFERLEIN

IPC: H05K7/14

Abstract: An electrical converter having pluggable converter components includes a first electronic assembly having electronic parts an assembly carrier, a housing chassis and a housing cover, wherein at least one of the electronic parts is a power semiconductor switch having a wide band gap and made of GaN or of InGaN. The power semiconductor switch is operated with a reverse bias of at least 400 V and at a clock frequency of at least 40 kHz during operation of the electrical converter. The first electronic assembly is mechanically plugged into the assembly carrier by connecting elements, and the first electronic assembly together with the assembly carrier is mechanically plugged and locked by further connecting elements to the housing chassis or to the housing cover using corresponding locking elements on the housing chassis or to the housing cover, respectively.

公开(公告)号：US20250157878A1

公开(公告)日：2025-05-15

申请号：US18720278

申请日：2022-11-08

Applicant: Siemens Aktiengesellschaft

Inventor： VLADIMIR DANOV ,  STEFAN PFEFFERLEIN ,  FLORIAN SCHWARZ ,  STEFAN STEGMEIER

IPC: H01L23/427 ,  H01L21/48 ,  H05K7/20

Abstract: An electronics module includes a pulsating heat pipe having a main body and a channel structure which is at least partially formed in the main body and in which a heat transfer medium is arranged. The main body includes a recess and is made at least partially of a dielectric material. An electronic component is thermally conductively connected to the heat transfer medium and designed as a vertical power semiconductor. A metal rib is secured in the recess and designed to protrude over a surface of the main body. The metal rib is in direct contact with the heat transfer medium.

公开(公告)号：US20180270979A1

公开(公告)日：2018-09-20

申请号：US15762451

申请日：2016-08-08

Applicant: Siemens Aktiengesellschaft

Inventor： Thomas Bigl ,  ALEXANDER HENSLER ,  STEPHAN NEUGEBAUER ,  STEFAN PFEFFERLEIN

IPC: H05K7/14 ,  H05K1/18 ,  H02M7/00 ,  H01G2/08 ,  H01G2/10

CPC classification number: H05K7/1427 ,  H01G2/08 ,  H01G2/10 ,  H01G4/28 ,  H01G4/32 ,  H01G4/40 ,  H01G9/151 ,  H01G9/28 ,  H02M5/458 ,  H02M7/003 ,  H05K1/181 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/1075

Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).

公开(公告)号：US20220208643A1

公开(公告)日：2022-06-30

申请号：US17617844

申请日：2020-06-05

Applicant: Siemens Aktiengesellschaft

Inventor： THOMAS BIGL ,  ALEXANDER HENSLER ,  STEPHAN NEUGEBAUER ,  STEFAN PFEFFERLEIN

IPC: H01L23/373 ,  H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H05K3/34 ,  H01L25/07 ,  H01L21/48 ,  H01L25/00

Abstract: An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.

公开(公告)号：US20220007543A1

公开(公告)日：2022-01-06

申请号：US17290587

申请日：2019-10-31

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： THOMAS BIGL ,  ALEXANDER HENSLER ,  STEPHAN NEUGEBAUER ,  EWGENIJ OCHS ,  PHILIPP OSCHMANN ,  STEFAN PFEFFERLEIN ,  ULRICH WETZEL

IPC: H05K7/20 ,  F28F21/08

Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.

公开(公告)号：US20200381370A1

公开(公告)日：2020-12-03

申请号：US16635882

申请日：2018-07-27

Applicant: Siemens Aktiengesellschaft

Inventor： STEFAN PFEFFERLEIN

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/538 ,  H01L23/31 ,  H05K5/06

Abstract: A power module includes a substrate having a first layer and a second layer which are connected to one another and arranged above one another. The first layer includes a first dielectric material having a metallization arranged on a side facing the second layer and the second layer includes a second dielectric material having a metallization arranged on a side facing away from the metallization of the first dielectric material. A power semiconductor having a first contact area and a second contact area opposite the first contact area is connected to the metallization of the first dielectric material via the first contact area and arranged in a first recess of the second layer. A metallic first encapsulation encapsulates the power semiconductor in a fluid-tight manner, with the second contact area of the power semiconductor being electrically conductively connected to the metallization of the second dielectric material via the first encapsulation.

公开(公告)号：US20240038630A1

公开(公告)日：2024-02-01

申请号：US18266033

申请日：2021-10-12

Applicant: Siemens Aktiengesellschaft

Inventor： STEFAN PFEFFERLEIN ,  RONNY WERNER

IPC: H01L23/427 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/427 ,  H01L23/49822 ,  H01L24/32 ,  H01L21/4882 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2924/13055

Abstract: A semiconductor module includes a first substrate, a second substrate having a closed, in particular continuous, hollow chamber structure, and a semiconductor element having a first side connected to the first substrate in a planar manner and a second side which faces away from the first side and is connected to the second substrate in a planar manner. A phase change material is arranged in the hollow chamber structure of the second substrate and in thermally conductive connection with the semiconductor element.

公开(公告)号：US20210050290A1

公开(公告)日：2021-02-18

申请号：US17042669

申请日：2019-03-26

Applicant: Siemens Aktiengesellschaft

Inventor： EWGENIJ OCHS ,  STEFAN PFEFFERLEIN

IPC: H01L23/498 ,  H01L23/367

Abstract: A semiconductor assembly includes a carrier element with a first carrier element conductor path, a semiconductor, an electrically insulating element having a first insulating element conductor path, and a first spacer element. The semiconductor is connected electrically and mechanically on a first semiconductor side via a first connecting material to the first carrier element conductor path, The semiconductor is connected on a second semiconductor side, which faces away from the first semiconductor side of the semiconductor, via a second connecting material to the first insulating element conductor path, which is arranged on a first insulating element side of the electrically insulating element, The first spacer element is arranged for maintaining a distance between the carrier element and an assembly element facing toward the second semiconductor side of the semiconductor and is connected mechanically to both the carrier element and the assembly element.

公开(公告)号：US20190393187A1

公开(公告)日：2019-12-26

申请号：US16481758

申请日：2018-01-22

Applicant: Siemens Aktiengesellschaft

Inventor： STEFAN PFEFFERLEIN ,  THOMAS BIGL

IPC: H01L23/00 ,  H05K3/28 ,  H05K3/34 ,  H01L23/498 ,  H05K1/18

Abstract: The invention relates to a method (20) for producing an electric circuit (2) in which a circuit carrier (4) comprising a first contact surface (14) and a second contact surface (16) is provided. An insulating body (26) is placed on the circuit carrier (4), wherein the insulating body (26) at least partially covers the first contact surface (14) and the second contact surface (16), and the insulating body (26) comprises a recess (34) in the region of both contact surfaces (14, 16). A flowable electro-conductive medium (44) is introduced into the insulating body (26). The invention also relates to an electric circuit (2) and to a further method (60) for producing an electric circuit (2).