公开(公告)号：WO2014074236A1

公开(公告)日：2014-05-15

申请号：PCT/US2013/061469

申请日：2013-09-24

Applicant: SILICON GRAPHICS INTERNATIONAL CORP.

Inventor： DEAN, Steven J. ,  COLLINS, David R. ,  MCCANN, Timothy Scott ,  FRANZ, Perry D. ,  GLANZMAN, Jeffrey M.

IPC: H05K5/00 ,  G06F1/20

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes one blade enclosure, and the cooling tower includes one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.

Abstract translation: 用于高性能计算系统的冷却系统包括具有两个计算机架和在计算机架之间的冷却塔的闭环冷却单元。 每个计算机架包括一个叶片外壳，并且冷却塔包括一个水冷热交换器和一个或多个鼓风机，其构造成将热空气从计算机架的侧面朝向后部穿过水冷式热交换器，并且 将冷却的空气循环到计算机架的一侧朝向前部。 冷却单元还包括封闭计算机架和冷却塔的壳体，以在冷却单元内提供闭环空气流。 冷却系统还包括构造成设置在计​​算刀片内的两个计算板之间的冷却板，以及耦合到冷却板并与叶片外壳流体连通的流体连接。

公开(公告)号：EP2918149A1

公开(公告)日：2015-09-16

申请号：EP13852972.2

申请日：2013-09-24

Applicant: Silicon Graphics International Corp.

Inventor： DEAN, Steven J. ,  COLLINS, David R. ,  MCCANN, Timothy Scott ,  FRANZ, Perry D. ,  GLANZMAN, Jeffrey M.

IPC: H05K5/00 ,  G06F1/20

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.