公开(公告)号：US20140268550A1

公开(公告)日：2014-09-18

申请号：US13931813

申请日：2013-06-29

Applicant: Silicon Graphics International Corp.

Inventor： Robert Michael Kinstle ,  Kevin Schlichter ,  Seitu Barron

IPC: H05K7/20

CPC classification number: G06F1/20 ,  H05K7/20154 ,  H05K7/20336 ,  H05K7/20436 ,  H05K7/20809

Abstract: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.

Abstract translation: 服务器包括具有前部和后部的托盘。 主板设置在托盘的前部，母板与散热器相连。 风扇设置在托盘的后部。 在主板和风扇之间设置硬盘驱动器，并且硬盘驱动器可操作地连接到主板。 服务器还包括具有纵向由入口和出口限定的主体的热管。 入口连接到散热器，而出口连接到风扇。 热管的主体延伸穿过硬盘。 电源还设置在托盘中并且可操作地连接到主板，风扇和硬盘驱动器。

公开(公告)号：US20170017278A1

公开(公告)日：2017-01-19

申请号：US15215009

申请日：2016-07-20

Applicant: SILICON GRAPHICS INTERNATIONAL CORP.

Inventor： Robert Michael Kinstle ,  Kevin Schlichter ,  Seitu Barron

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  H05K7/20154 ,  H05K7/20336 ,  H05K7/20436 ,  H05K7/20809

Abstract: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.

Abstract translation: 服务器包括具有前部和后部的托盘。 主板设置在托盘的前部，母板与散热器相连。 风扇设置在托盘的后部。 在主板和风扇之间设置硬盘驱动器，并且硬盘驱动器可操作地连接到主板。 服务器还包括具有纵向由入口和出口限定的主体的热管。 入口连接到散热器，而出口连接到风扇。 热管的主体延伸穿过硬盘。 电源还设置在托盘中并且可操作地连接到主板，风扇和硬盘驱动器。

公开(公告)号：US09426932B2

公开(公告)日：2016-08-23

申请号：US13931813

申请日：2013-06-29

Applicant: Silicon Graphics International Corp.

Inventor： Robert Michael Kinstle ,  Kevin Schlichter ,  Seitu Barron

IPC: H05K7/20

CPC classification number: G06F1/20 ,  H05K7/20154 ,  H05K7/20336 ,  H05K7/20436 ,  H05K7/20809

Abstract: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.

Abstract translation: 服务器包括具有前部和后部的托盘。 主板设置在托盘的前部，母板与散热器相连。 风扇设置在托盘的后部。 在主板和风扇之间设置硬盘驱动器，并且硬盘驱动器可操作地连接到主板。 服务器还包括具有纵向由入口和出口限定的主体的热管。 入口连接到散热器，而出口连接到风扇。 热管的主体延伸穿过硬盘。 电源还设置在托盘中并且可操作地连接到主板，风扇和硬盘驱动器。