公开(公告)号：US20140268552A1

公开(公告)日：2014-09-18

申请号：US13931814

申请日：2013-06-29

Applicant: Silicon Graphics International Corp.

Inventor： Ronald Provenzale ,  Seitu Barron ,  Robert Michael Kinstle III ,  Kevin Schlichter

IPC: H05K7/20

CPC classification number: H05K7/20727

Abstract: A server provides for improved cooling using one or more baffles. The baffles allow for increased cooling efficiencies by directing heat in such a manner as to reduce heat exposure for temperature sensitive hardware and data center employees. The baffle may be disposed within a server and direct hot air through the server away from temperature sensitive devices. The baffle may include an inlet that receives hot air and an outlet through which hot air may exit. One or more fans may be used to direct air through the baffle. For example, the baffle may direct heat from the baffle inlet to the baffle outlet, directing heat away from temperature sensitive devices within the server.

Abstract translation: 服务器提供使用一个或多个挡板进行改进的冷却。 通过引导热量以减少温度敏感的硬件和数据中心员工的热暴露，挡板可以提高冷却效率。 挡板可以设置在服务器内，并将热空气通过服务器远离温度敏感设备。 挡板可以包括接收热空气的入口和热空气可以通过该出口排出。 可以使用一个或多个风扇来引导空气通过挡板。 例如，挡板可以将热量从挡板入口引导到挡板出口，从而将热量从服务器内的温度敏感设备引导出来。