公开(公告)号：US20140268553A1

公开(公告)日：2014-09-18

申请号：US13931781

申请日：2013-06-28

Applicant: Silicon Graphics International Corp.

Inventor： Kevin Lee Van Pelt ,  Theodore Robert Johnson ,  Robert Michael Kinstle III

IPC: H05K7/20

CPC classification number: H05K7/20809 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20709 ,  H01L2924/00

Abstract: A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The front heat sink may have a plurality of fins and a corresponding fin pitch. The system may further include a rear CPU disposed in line with the front CPU and a rear heat sink coupled to the rear CPU. The rear heat sink may have a plurality of fins and a corresponding fin pitch. The fin pitch of the rear heat sink may be higher than the fin pitch of the front heat sink. In another embodiment, the front and rear heat sinks may be coupled together by one or more heat pipes.

Abstract translation: 提供了一种用于冷却密闭外壳中的多个在线CPU的系统。 在一个实施例中，系统可以包括可以耦合到前CPU的前CPU和前散热器。 前散热片可以具有多个翅片和相应的翅片间距。 该系统可以进一步包括与前CPU一致地布置的后CPU和耦合到后CPU的后散热器。 后散热器可以具有多个翅片和相应的翅片间距。 后散热片的翅片间距可能高于前散热片的散热片间距。 在另一个实施例中，前后散热片可以由一个或多个热管联接在一起。