公开(公告)号：US12100633B2

公开(公告)日：2024-09-24

申请号：US18214969

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US12014967B2

公开(公告)日：2024-06-18

申请号：US18215113

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US20230343663A1

公开(公告)日：2023-10-26

申请号：US18214969

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US20230386992A1

公开(公告)日：2023-11-30

申请号：US18234695

申请日：2023-08-16

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Chia-Chu Lai ,  Min-Han Chuang

IPC: H01L23/522 ,  H01L23/31

CPC classification number: H01L23/5223 ,  H01L28/40 ,  H01L23/31 ,  H01L23/5226

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

公开(公告)号：US20230343665A1

公开(公告)日：2023-10-26

申请号：US18215113

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US09698090B2

公开(公告)日：2017-07-04

申请号：US13753882

申请日：2013-01-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Shiang Fang ,  Ho-Chuan Lin ,  Chia-Chu Lai ,  Min-Han Chuang ,  Li-Fang Lin

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/14 ,  H01L23/13 ,  H01L21/768

CPC classification number: H01L23/49827 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/19011 ,  H01L2924/00

Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.

公开(公告)号：US09281557B2

公开(公告)日：2016-03-08

申请号：US14090787

申请日：2013-11-26

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Chia-Chu Lai ,  Min-Han Chuang ,  Bo-Shiang Fang ,  Ho-Chuan Lin ,  Li-Fang Lin

IPC: H01Q1/50 ,  H03H5/00 ,  H03H7/42

CPC classification number: H01Q1/50 ,  H03H7/425

Abstract: A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween.

Abstract translation: 提供了一种多频带平衡 - 不平衡变压器，包括主信号端口，电连接到主信号端口的主电感器，与主电感器相互感应的第一电感器，以构成第一转换电路的第一电感器;第一电容器模块， 与第一转换电路平行的两个第一信号端口电连接到第一电容器模块，电连接到第一信号端口和第一电容器模块之间的第一主电容器，与主电感器相互感应的第二电感器，以构成第二电容器 第二转换电路的电感器，与第二转换电路并联连接的第二电容器模块，电连接到第二电容器模块的两个第二信号端口，以及与第二信号端口和第二电容器模块电连接的第二主电容器 。

公开(公告)号：US20140204806A1

公开(公告)日：2014-07-24

申请号：US13875550

申请日：2013-05-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Min-Han Chuang ,  Chia-Chu Lai ,  Bo-Shiang Fang ,  Ho-Chuan Lin ,  Yen-Yu Chen

IPC: H03H7/46

CPC classification number: H03H7/463 ,  H03H7/09 ,  H03H7/1775 ,  H03H7/1783 ,  H03H2001/0064 ,  H03H2001/0078

Abstract: A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween.

Abstract translation: 提供了一种双工器，其包括第一，第二和第三信号端口; 第一过滤器和第二过滤器。 第一滤波器具有分别具有第一，第二和第三电感器的第一，第二和第三谐振电路。 第一，第二和第三电感器是互感的。 第一和第三谐振电路分别电连接到第一和第二信号端口。 第二滤波器具有分别具有第四，第五和第六电感器的第四，第五和第六谐振电路。 第四谐振电路与第一谐振电路串联连接。 第五电感器和第四电感器是互感的。 第六谐振电路与第三信号端口电连接。 第二滤波器还具有分别与第五和第六谐振电路串联连接的主电容器，并位于它们之间。

公开(公告)号：US20140015621A1

公开(公告)日：2014-01-16

申请号：US13644507

申请日：2012-10-04

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Hsin-Hung Lee ,  Chia-Chu Lai ,  Yen-Yu Chen ,  Ho-Chuan Lin

IPC: H03H5/10

CPC classification number: H03H7/42

Abstract: A balanced-to-unbalanced converter (balun) is provided, including: a converting circuit having a first processing circuit including a first inductor and a first capacitor connected in series, a second processing circuit including a second capacitor and a second inductor connected in series, the second capacitor being electrically connected to the first inductor, and two balanced output ends connected to the first processing circuit and the second processing circuit, respectively; and a preprocessing circuit connected to the converting circuit and including an unbalanced input end for converting real impedance at the unbalanced input end into complex impedance at the balanced output ends. Accordingly, the balun satisfies the need of the wireless communication chips by providing differential signals with complex impedance. This is done by employing the preprocessing circuit in conjunction with the converting circuit to convert an unbalanced signal with real impedance into a balanced signal with complex impedance.

Abstract translation: 提供了一种平衡 - 不平衡转换器（balun），包括：具有第一处理电路的转换电路，包括第一电感器和串联连接的第一电容器，第二处理电路包括串联连接的第二电容器和第二电感器 所述第二电容器电连接到所述第一电感器，以及两个平衡输出端分别连接到所述第一处理电路和所述第二处理电路; 以及连接到转换电路并且包括用于将不平衡输入端处的实际阻抗转换成平衡输出端的复阻抗的不平衡输入端的预处理电路。 因此，平衡 - 不平衡变压器通过提供具有复阻抗的差分信号来满足无线通信芯片的需要。 这通过使用预处理电路与转换电路结合来实现，将具有实际阻抗的不平衡信号转换成具有复阻抗的平衡信号。

公开(公告)号：US12027753B2

公开(公告)日：2024-07-02

申请号：US17360843

申请日：2021-06-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chia-Chu Lai ,  Ho-Chuan Lin ,  Min-Han Chuang

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H01L2223/6616 ,  H01L2223/6677

Abstract: An electronic package is provided, in which a ground layer is arranged on one side of an insulator, and a first antenna portion and a second antenna portion embedded in the insulator are vertically disposed on the ground layer, where a gap is formed between the first antenna portion and the second antenna portion, such that the first antenna portion and the second antenna portion are electrically matched with each other, and the ground layer is electrically connected to the second antenna portion but free from being electrically connected to the first antenna portion.