公开(公告)号：US20240107658A1

公开(公告)日：2024-03-28

申请号：US18511466

申请日：2023-11-16

Applicant: Solid-tech Co., Ltd.

Inventor： Tzu Chien HUNG ,  Chun-Teng KO ,  Bomin TU ,  Zhengyu LEE

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/38

CPC classification number: H05K1/0209 ,  H05K1/0212 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/09872 ,  H05K2203/0522

Abstract: This invention provides a carrier or submount for high power devices packaging and a method for forming the carrier or submount. The carrier comprises a thermal conductive ceramic substrate, a patterned adhesion layer on the substrate, a heat dissipation layer on the patterned adhesion layer, a conformal cover layer enclosing the heat dissipation layer and the adhesion layer, a diffusion barrier layer on the conformal cover layer, an eutectic bonding layer on the diffusion barrier layer, and a dissipation ceramic substrate with an L-shape bonding conductor, wherein one end of the L-shape bonding conductor bonds to the power device and the other end bonds to the conformal cover layer at the second region. The substrate includes a first region for bonding high power device, a second region for wire-bonding, and a third region for heat sink. The first region and second region are on a first surface of the substrate, and the third region is one the second surface, opposite to the first surface, of the substrate.