Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna

    公开(公告)号:US11244220B2

    公开(公告)日:2022-02-08

    申请号:US16760992

    申请日:2018-10-31

    Applicant: Stora Enso OYJ

    Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.

    METHOD FOR MANUFACTURING AN RFID TAG AND AN RFID TAG COMPRISING AN IC AND AN ANTENNA

    公开(公告)号:US20200311508A1

    公开(公告)日:2020-10-01

    申请号:US16760992

    申请日:2018-10-31

    Applicant: Stora Enso OYJ

    Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.

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