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公开(公告)号:US11244220B2
公开(公告)日:2022-02-08
申请号:US16760992
申请日:2018-10-31
Applicant: Stora Enso OYJ
Inventor: Lauri Huhtasalo , Eerik Halonen , Juha Ikonen
IPC: G06K19/077 , G06K19/07
Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.
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公开(公告)号:US20200311508A1
公开(公告)日:2020-10-01
申请号:US16760992
申请日:2018-10-31
Applicant: Stora Enso OYJ
Inventor: Lauri Huhtasalo , Eerik Halonen , Juha Ikonen
IPC: G06K19/077 , G06K19/07
Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.
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