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1.发明授权公开(公告)号：US11414532B2
公开(公告)日：2022-08-16
申请号：US16123509
申请日：2018-09-06
Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
Inventor： Chih-Wei Liao , Guan-Syun Tseng , Tsung-Hsien Lin , Ju-Ming Huang
Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.
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公开(公告)号：US10920008B2
公开(公告)日：2021-02-16
申请号：US16250422
申请日：2019-01-17
Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
Inventor： Ju-Ming Huang , Chen-Hua Yu , Chang-Chien Yang , Guan-Syun Tseng , Chih-Wei Liao
IPC: C08G59/06 , C08G59/30 , C08G59/26 , C08G59/28 , C08K5/00 , C08K5/5397 , C08J5/24 , H05K3/00 , C08K5/5399 , C08K3/013
Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.
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Patent Agency Ranking
公开(公告)号：US10563006B2
公开(公告)日：2020-02-18
申请号：US15664156
申请日：2017-07-31
Applicant: Taiwan Union Technology Corporation
Inventor： Guan-Syun Tseng , Ju-Ming Huang , Tsung-Hsien Lin , Chang-Chien Yang , Chih-Wei Liao
IPC: C08G59/62 , C08G59/40 , H05K1/03 , C08G59/32 , C08G59/34 , C08G59/68 , C08J5/24 , C08L63/04 , H05K1/02 , C08L63/00 , C08K3/36
Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
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公开(公告)号：US11643544B2
公开(公告)日：2023-05-09
申请号：US16133083
申请日：2018-09-17
Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
Inventor： Chih-Wei Liao , Ju-Ming Huang , Guan-Syun Tseng
IPC: C08L63/00 , H05K1/03 , C08K5/3492 , C08K3/36 , C08K3/22 , C08K3/28 , C08K5/00 , C08J5/24 , C08K5/42 , C08K5/18
CPC classification number: C08L63/00 , C08J5/244 , C08J5/249 , C08K3/22 , C08K3/28 , C08K3/36 , C08K5/0066 , C08K5/3492 , H05K1/0373 , C08J2363/02 , C08K5/18 , C08K5/42 , C08L2201/02 , C08L2203/20
Abstract: A resin composition is provided. The resin composition includes the following constituents:
(A) an epoxy resin;
(B) an amino group-containing hardener; and
(C) a compound of formula (I),
wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).-
公开(公告)号：US11008456B2
公开(公告)日：2021-05-18
申请号：US16447748
申请日：2019-06-20
Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
Inventor： Chih-Wei Liao , Guan-Syun Tseng , Chen-Hua Yu
IPC: C08L71/12 , C08K5/00 , C08K3/013 , C08K3/04 , C08K3/36 , H05K1/03 , C08K7/10 , C08K7/20 , C08J5/24 , C08K5/14 , C08L27/18
Abstract: A resin composition comprising the following constituents: (A) a polyphenylene ether resin with unsaturated end groups; (B) a constituent with a maleimide structure; (C) a first initiator, which has a first one-minute half-life temperature; and (D) a second initiator, which has a second one-minute half-life temperature, wherein the first one-minute half-life temperature is 20° C. to 50° C. higher than the second one-minute half-life temperature, and the first one-minute half-life temperature is 170° C. to 220° C.
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公开(公告)号：US11339258B2
公开(公告)日：2022-05-24
申请号：US16009266
申请日：2018-06-15
Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
Inventor： Chih-Wei Liao , Guan-Syun Tseng , Tsung-Hsien Lin , Ju-Ming Huang , Chen-Hua Yu
IPC: C08J5/24 , C09D163/00 , C09D5/18 , B32B15/092 , H05K1/03 , H05K1/02 , H05K3/02 , C08L63/00 , B32B15/08 , B32B15/098 , B32B15/14 , C08G8/04 , C08G59/40 , C08G8/12 , C08J7/04 , C08L61/04 , C08L61/06 , C08K5/00 , C08K5/51 , C08K5/53 , C08K3/013 , C08K5/49 , C08K5/5313 , C09D161/04 , C09D161/06
Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, l, R1, and R2 are as defined in the specification.
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7.发明申请公开(公告)号：US20180044467A1
公开(公告)日：2018-02-15
申请号：US15664156
申请日：2017-07-31
Applicant: Taiwan Union Technology Corporation
Inventor： Guan-Syun Tseng , Ju-Ming Huang , Tsung-Hsien Lin , Chang-Chien Yang , Chih-Wei Liao
CPC classification number: C08G59/621 , C08G59/3218 , C08G59/34 , C08G59/4014 , C08G59/4071 , C08G59/686 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08J2463/00 , C08J2463/04 , C08J2463/08 , C08L63/00 , C08L63/04 , C08L2203/20 , C08L2205/02 , C08L2205/025 , C08L2205/035 , C08L2205/05 , H05K1/02 , H05K1/0326 , C08K3/36
Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
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