公开(公告)号：KR20200139632A

公开(公告)日：2020-12-14

申请号：KR20200064980

申请日：2020-05-29

Applicant: TAIYO INK MFG CO LTD

Inventor： ARAI YASUAKI ,  SHIRAKAWA KENICHI ,  YANAGIDA NOBUYUKI

IPC: C08K3/013 ,  C08J5/18 ,  C08J7/04 ,  C08K3/30 ,  C08K3/36 ,  C08K5/353 ,  C08L101/08 ,  C09D7/61 ,  C09D201/08 ,  H05K3/28

Abstract: 본발명은박막시에도건조전도막이나건조후도막의막두께의편차가작고, 구리비침현상이발생하지않는경화성수지조성물의제공을과제로하는것으로, 본발명에의한경화성수지조성물은경화성수지및 체질안료를함유하는경화성수지조성물로서, 상기경화성수지조성물의경화후막두께 12㎛인경화도막에서의 60°의광택도가 0.5 이상 40.0 이하의범위내이고, 상기경화성수지조성물 0.3g을프로필렌글리콜모노메틸에테르아세테이트 30g과혼합하고, 마이크로트랙을사용하여측정했을때의평균입자경(D50)이 0.1㎛이상 1.0㎛이하, 또한비표면적(CS)이 10.0㎡/ml 이상인것을특징으로한다.

公开(公告)号：JP2000103643A

公开(公告)日：2000-04-11

申请号：JP27593598

申请日：1998-09-29

Applicant: TAIYO INK MFG CO LTD

Inventor： KAKINUMA MASAHISA ,  KOJIMA HIDEAKI ,  YANAGIDA NOBUYUKI

IPC: H01J9/02 ,  C03C17/04

Abstract: PROBLEM TO BE SOLVED: To provide a high-precision and inexpensive mold having sufficient mechanical strength, hardness and repeating serviceability, and to provide a method for producing the subject high-precision coating film at low cost in high yield through a simple process using transfer technique. SOLUTION: This method for producing a patterned inorganic burnt coating film by transfer technique comprises using such a mold 1 that the surface of a resin coating layer 3 having specified pattern grooves 4 provided on a mold substrate 2 is coated with an inorganic film 5. The other objective patterned inorganic burnt coating film is obtained by the following process: the above pattern grooves 4 are filled with a glass paste composition 10, a transparent substrate 11 is then superposed upon the composition followed by active energy ray irradiation or treatment under heating to effect hardening or drying the glass paste composition followed by removing the mold off the transparent substrate and the hardened or dried glass paste composition 10a jointed thereto, and both the substrate and the hardened or dried glass paste composition are subsequently burned.

公开(公告)号：JP2001278906A

公开(公告)日：2001-10-10

申请号：JP2000096295

申请日：2000-03-31

Applicant: TAIYO INK MFG CO LTD

Inventor： YANAGIDA NOBUYUKI ,  KOJIMA HIDEAKI

IPC: C08F2/50 ,  C08F2/44 ,  C08F291/00 ,  G03F7/00 ,  G03F7/027 ,  G03F7/032 ,  H01J9/24 ,  H01J11/22 ,  H01J11/34 ,  H01J11/36 ,  H01J11/02

Abstract: PROBLEM TO BE SOLVED: To provide a photo-curing paste composition with a good characteristic of filling crevices, an excellent photo-curing property and no possibility of generating a flake or a crack of a pattern during baking. SOLUTION: A photo-curing paste composition comprises (A) fine inorganic particles, (B) a binder polymer with no ethylenically unsaturated double bond, (C) a photo-curing compound and (D) a photopolymerization initiator. Preferably, the above (B) constituent dissolved in at least one kind of the above (C) constituent is used. And the above photo-curing compound (C) consists of a liquid mono- functional photo-curing compound with one ethylenically unsaturated double bond in one molecule and a multi-functinal photo-curing compound with more than one ethylenically unsaturated double bond in one molecule. The composition can be applied profitably to a method of forming inorganic baked patterns such as a partition pattern in PDP, FED, LCD or the like, an electrode (a conductor circuit) pattern, and a dielectric (resistor) pattern, using a groove (concave) part formed in a predetermined pattern.

公开(公告)号：JPH11249302A

公开(公告)日：1999-09-17

申请号：JP6390298

申请日：1998-03-02

Applicant: TAIYO INK MFG CO LTD

Inventor： KAKINUMA MASAHISA ,  KOJIMA HIDEAKI ,  YANAGIDA NOBUYUKI

IPC: H01B3/30 ,  C08F2/44 ,  C08F2/48 ,  G03F7/00 ,  G03F7/004 ,  G03F7/027 ,  G03F7/038 ,  H01J9/20 ,  H01J11/22 ,  H01J11/34 ,  H01J11/42 ,  H05K1/09

Abstract: PROBLEM TO BE SOLVED: To obtain an alkali developable photosensitive compsn. capable of easily forming a high definition baked material pattern such as an electrically conductive pattern, a glassy dielectric pattern or a phosphor pattern by photolithography without causing problems such as the twist of the pattern and the reduction of the line width after baking and to obtain the baked material pattern using the photosensitive compsn. SOLUTION: The photosensitive compsn. contains (A) a carboxyl-contg. photosensitive polymer obtd. by allowing a copolymer of a compd. having an unsatd. double bond and a carboxyl group and a compd. having an unsatd. double bond to react with a compd. having an unsatd. double bond and a glycidyl group, (B) a diluent, (C) a photopolymn. initiator, (D) an inorg. powder and (E) a stabilizer. The photosensitive compsn. is applied on a substrate, exposed according to a prescribed pattern, developed with an aq. alkali soln. and baked to form the objective high definition baked material pattern.

公开(公告)号：JP2002363231A

公开(公告)日：2002-12-18

申请号：JP2001171410

申请日：2001-06-06

Applicant: TAIYO INK MFG CO LTD

Inventor： KAMAYACHI YUICHI ,  ITOKAWA GEN ,  YANAGIDA NOBUYUKI

IPC: G03F7/004 ,  C08F290/12 ,  C08G59/42 ,  G03F7/028 ,  G03F7/038

Abstract: PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition having both excellent development property and photoreactivity without deteriorating characteristics such as heat resistance. SOLUTION: This resin composition is characterized by comprising an active energy ray-curable resin (A) obtained by adding an epoxy group-containing unsaturated compound (a-4) to an acid group of a part of a copolymer composed of a monomer of an ethylenic unsaturated group-containing carboxylic acid (a-1) represented by the formula (1) or (2) CH2 =C(R)-CO[O(CH2 )5 CO]n -OH...(1) or CH2 =C(R)COOCH2 CH2 O[CO(CH2 )6 O]n -CO-X-COOH...(2) ((n) is an integer of 1-10; R is hydrogen atom or methyl group; X is a 1-4C carboxylic acid (anhydride) residue) and a (meth)acrylic acid ester (a-2), and a photopolymerization initiator (B).

公开(公告)号：JP2019091858A

公开(公告)日：2019-06-13

申请号：JP2017221167

申请日：2017-11-16

Applicant: TAIYO INK MFG CO LTD

Inventor： YANAGIDA NOBUYUKI ,  NITA KAN ,  ICHIKAWA HIBIKI ,  SHIRAKAWA KENICHI

IPC: H05K3/24 ,  H05K3/18

Abstract: 【課題】めっきレジストを塗布する工程を含まない、より簡単な工程により、実装可能な銅表面を形成できるプリント配線板の製造方法を提供する。【解決手段】導体回路2を有する配線基板1上に感光性樹脂組成物の塗膜3を形成する工程と、感光性樹脂組成物の塗膜3に、未反応部33、不完全反応部32および完全反応部31を設ける工程と、現像により、第1パッド部51を形成するとともに、現像残膜32Aを有する第2パッド部52用開口を形成する工程と、第1パッド部51にめっき処理を行う工程と、めっき処理後、現像残膜32Aを除去して、第2パッド部52を形成する工程と、を含む。【選択図】図1

公开(公告)号：JP2000105453A

公开(公告)日：2000-04-11

申请号：JP21298799

申请日：1999-07-28

Applicant: TAIYO INK MFG CO LTD

Inventor： AKAGAWA MAYUMI ,  YAMASHITA SHIYUUKO ,  YANAGIDA NOBUYUKI ,  KAKINUMA MASAHISA ,  KOJIMA HIDEAKI

IPC: H01J9/02 ,  C08F2/44 ,  C08F2/46 ,  C08F299/00 ,  G03F7/004 ,  H01J11/22 ,  H01J11/34 ,  H01J11/36 ,  H01J11/44 ,  H01J11/02

Abstract: PROBLEM TO BE SOLVED: To obtain a photosetting glass paste composition containing a remarkably reduced amount of an organic solvent or no organic solvent and excellent in suitability to filling into grooves and firing and to form a high definition fired material pattern with low energy consumption and good productivity at a low cost by using the composition. SOLUTION: The photosetting glass paste composition contains fine glass particles, a liquid photosetting compound, a photopolymerization initiator and a dispersant having a polar group having an affinity for the fine glass particles. The photosetting glass paste composition is applied in such a way that it is filled into the grooves 12 in a photosensitive film 10 having a prescribed pattern on a substrate 1 and the composition is photoset by exposure. The photosensitive film 10 is then removed with a removing agent and firing is carried out.