公开(公告)号：FI20215203A1

公开(公告)日：2022-05-13

申请号：FI20215203

申请日：2021-02-23

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： LEHTINEN JANNE ,  MYKKÄNEN EMMA ,  KEMPPINEN ANTTI ,  RONZANI ALBERTO ,  PRUNNILA MIKA

IPC: H01L39/04 ,  H01L35/00 ,  H05K9/00

Abstract: A device (100) for shielding at least one component from thermal radiation, the device comprising at least a first substrate (102) with a first surface (104) and a second surface (106) and a second substrate (108) with a first surface (110) and second surface (112), the first surface of the second substrate being arranged to at least partially face the second surface of the first substrate. The device additionally comprises at least a first component (114) arranged on the first surface of the second substrate or the second surface of the first substrate and a shielding arrangement comprising a plurality of shielding elements (116, 118, 120) comprising electrically conductive material, the shielding elements being configured to essentially surround at least the first component to provide a shielded area within which the first component is located, wherein electromagnetic radiation having wavelength longer than a selected first wavelength is essentially prevented from reaching the shielded area.

公开(公告)号：FI20215201A1

公开(公告)日：2022-08-24

申请号：FI20215201

申请日：2021-02-23

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： PRUNNILA MIKA ,  KEMPPINEN ANTTI ,  LEHTINEN JANNE ,  RONZANI ALBERTO ,  MYKKÄNEN EMMA

IPC: H01L23/373 ,  F25B21/00 ,  F25D19/00 ,  H01L23/367 ,  H01L39/22

Abstract: An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

公开(公告)号：FI129589B

公开(公告)日：2022-05-13

申请号：FI20215203

申请日：2021-02-23

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： KEMPPINEN ANTTI ,  LEHTINEN JANNE ,  PRUNNILA MIKA ,  MYKKÄNEN EMMA ,  RONZANI ALBERTO

IPC: H01L39/04 ,  H01L35/00 ,  H05K9/00

Abstract: A device (100) for shielding at least one component from thermal radiation, the device comprising at least a first substrate (102) with a first surface (104) and a second surface (106) and a second substrate (108) with a first surface (110) and second surface (112), the first surface of the second substrate being arranged to at least partially face the second surface of the first substrate. The device additionally comprises at least a first component (114) arranged on the first surface of the second substrate or the second surface of the first substrate and a shielding arrangement comprising a plurality of shielding elements (116, 118, 120) comprising electrically conductive material, the shielding elements being configured to essentially surround at least the first component to provide a shielded area within which the first component is located, wherein electromagnetic radiation having wavelength longer than a selected first wavelength is essentially prevented from reaching the shielded area.