公开(公告)号：US3796263A

公开(公告)日：1974-03-12

申请号：US3796263D

申请日：1972-06-15

Applicant: TEXACO INC

Inventor： HUDSON P ,  BRADEN W

IPC: C09K8/575 ,  C09K8/60 ,  E21B33/138

CPC classification number: C09K8/5755 ,  C09K8/607

Abstract: A method of treating underground formations, especially those containing clays or clay-like materials which are sensitive to fresh water, to desensitize the clays so they will not swell or disperse on contact with fresh water. The treatment consists of contacting the clay-containing formation with solutions which accomplish the electroless deposition of metal on the clay particles. Optionally, the formation can be resin coated prior to electroless plating.

Abstract translation: 处理地下地层的方法，特别是那些含有对淡水敏感的粘土或粘土状材料的地层，使粘土脱敏，使其不会在与淡水接触时膨胀或分散。 处理包括使含粘土的地层与实现金属在粘土颗粒上无电沉积的溶液接触。 任选地，在无电镀之前，可以对该地层进行树脂涂覆。