公开(公告)号：KR780000595B1

公开(公告)日：1978-11-23

申请号：KR730001720

申请日：1973-10-17

Applicant: TEXAS INSTRUMENTS INC

Inventor： TERRY WAYNE NOE

IPC: H01L23/28 ,  H01L21/00 ,  H01L21/60 ,  H01L23/495 ,  H05K1/09

公开(公告)号：IT991996B

公开(公告)日：1975-08-30

申请号：IT5178573

申请日：1973-08-01

Applicant: TEXAS INSTRUMENTS INC

Inventor： TERRY WAYNE NOE

IPC: H01L23/28 ,  H01L21/00 ,  H01L21/60 ,  H01L23/495 ,  H05K1/09 ,  H01L

Abstract: A dual-in-line plastic package for an integrated circuit is assembled with the use of a thermal stress-resistant thin-film interconnect pattern on a flexible insulator film. All electrical connections to the semiconductor chip are made simultaneously by bonding directly to the thin-film interconnect pattern. Each segment of the interconnect pattern is then connected simultaneously to a simplified external lead frame, by means of a novel soldering technique. The assembly is then ready for plastic encapsulation and final trimming. By supplying both the flexible interconnect pattern and the external lead frame in continuous coils or reels, a high degree of handling simplicity, speed and accuracy is achieved with a maximum opportunity for automation, to produce a low work content product.