WIRELESS DEVICE WITH SUBSTRATE TO ANTENNA COUPLING

    公开(公告)号:US20210218125A1

    公开(公告)日:2021-07-15

    申请号:US17116668

    申请日:2020-12-09

    Abstract: A device comprises an integrated circuit (IC) die, a substrate, a printed circuit board (PCB), an antenna, and a waveguide stub. The IC die is affixed to the substrate, which comprises a signal launch on a surface of the substrate that is configured to emit or receive a signal. The substrate and the antenna are affixed to the PCB, such that the signal launch and a waveguide opening of the antenna are aligned and comprise a signal channel. The waveguide stub is arranged as a boundary around the signal channel. In some implementations, the waveguide stub has a height of λ/4, where λ represents a wavelength of the signal. In some implementations, the antenna includes the waveguide stub; in others, the substrate includes the waveguide stub.

    MILLIMETER WAVE QUANTUM SENSOR DEVICE

    公开(公告)号:US20250141098A1

    公开(公告)日:2025-05-01

    申请号:US18496654

    申请日:2023-10-27

    Abstract: A device comprises a U-shaped cell configured to contain a quantum gas, a first waveguide coupled to an inlet of the U-shaped cell, and a second waveguide coupled to an outlet of the U-shaped cell. The device also comprises a multi-layer substrate including transmitter and receiver antennas that are aligned with the first and second waveguides, respectively, the substrate including a network of metal layers coupled to the transmitter and receiver antennas. The device also includes transmitter and receiver dies coupled to the transmitter and receiver antennas, respectively, by way of the network of metal layers, the substrate positioned between the U-shaped cell and the transmitter and receiver dies.

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