公开(公告)号：MY7300374A

公开(公告)日：1973-12-31

申请号：MY7300374

申请日：1973-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： JACK ST.CLAIR KIRBY ,  HAROLD DEAN TOOMBS ,  JAMES HENRY VAN TASSEL

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/30 ,  H01L23/48

Abstract: Disclosed is a method of packaging multilead semiconductor devices and the resulting product. A layer of conductive metal is bonded to a sheet of dielectric material containing a cavity. The conductive layer is masked and etched to form individual strip leads which adhere to the dielectric sheet and extend out into the cavity. A multilead semiconductor device is then located in the cavity with its contacts bondedto the strip leads extending from the dielectric sheet. Also disclosed is a multilead package for a multilead electrical device that includes a support member with at least one opening in it and a plurality of conductive ribbons formed on one surface of the support member. Each of the conductive ribbons has one end that extends into the opening and another end that terminates in close proximity to the periphery of the support member.