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公开(公告)号：US11884538B2
公开(公告)日：2024-01-30
申请号：US17487203
申请日：2021-09-28
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Marco Corsi , Barry Jon Male
CPC classification number: B81B7/008 , B81B7/007 , B81B7/02 , B81C1/00238 , B81B2201/0278
Abstract: A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.
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公开(公告)号：US11495522B2
公开(公告)日：2022-11-08
申请号：US17120941
申请日：2020-12-14
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Barry Jon Male , Marco Corsi
IPC: H01L23/495 , H01L23/00 , H01L23/532
Abstract: In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.
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公开(公告)号：US10251258B2
公开(公告)日：2019-04-02
申请号：US15195415
申请日：2016-06-28
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Juan A. Herbsommer , Robert F. Payne , Marco Corsi , Baher S. Haroun , Hassan Ali
Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
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公开(公告)号：US12074095B2
公开(公告)日：2024-08-27
申请号：US18052643
申请日：2022-11-04
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Barry Jon Male , Marco Corsi
IPC: H01L23/495 , H01L23/00 , H01L23/532
CPC classification number: H01L23/49503 , H01L23/49531 , H01L23/49541 , H01L23/53214 , H01L24/93
Abstract: In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.
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公开(公告)号：US10823581B2
公开(公告)日：2020-11-03
申请号：US14981894
申请日：2015-12-28
Applicant: Texas Instruments Incorporated
Inventor： Sriram Narayanan , David Louis Freeman , Marco Corsi
Abstract: A sensor power management arrangement includes a signal processing circuit configured to receive signal from a sensor, to test the signal against at least one criterion, and to pass the signal for further processing in response to the signal passing the at least one criterion. In this way, only signals that are of a sufficient importance or significance will consume the maximum amount of processing energy and through processing by later processes or circuitry. Should a signal from a sensor not be strong enough or meet other criteria, power will not be wasted in preparing that signal for provision to the microcontroller or microprocessor. Additional flexibility in the sensor power management can be realized by adjusting the criteria against which the sensor signal is compared based on a status of the sensor apparatus.
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Patent Agency Ranking
6.发明申请CHIP TO DIELECTRIC WAVEGUIDE INTERFACE FOR SUB-MILLIMETER WAVE COMMUNICATIONS LINK 审中-公开切割到用于亚微波通信的电介质波导接口公开(公告)号：US20150280320A1
公开(公告)日：2015-10-01
申请号：US14734371
申请日：2015-06-09
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
CPC classification number: H01Q3/44 , H01L23/3107 , H01L23/66 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/3011 , H01Q3/26 , H01Q9/0407 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.
Abstract translation: 在一些开发的互连技术中，例如芯片到芯片的光学互连或金属波导互连，错位可能是一个严重的问题。 然而，这里提供了使用片上定向天线（其在亚毫米范围内操作）通过介质波导形成射频（RF）互连的互连。 该系统允许不对准，同时提供增加的通信带宽。
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公开(公告)号：US11322217B2
公开(公告)日：2022-05-03
申请号：US17003185
申请日：2020-08-26
Applicant: Texas Instruments Incorporated
Inventor： Ashwin Raghunathan , Marco Corsi , Baher Haroun , Seyed Miaad Seyed Aliroteh , Swaminathan Sankaran , Robert Floyd Payne
Abstract: A track and hold circuit includes a signal input terminal, a clock input terminal, an output terminal, a transistor, and a bootstrapping circuit with a transformer. The transistor includes a source, a drain, and a gate, where the source is coupled to the signal input terminal, and the drain is coupled to the output terminal. The transformer includes a primary winding coupled to the clock input terminal, and a secondary winding. The secondary winding is coupled between the source and the gate to control a gate-source voltage of the transistor.
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公开(公告)号：US09699705B2
公开(公告)日：2017-07-04
申请号：US13901814
申请日：2013-05-24
Applicant: Texas Instruments Incorporated
Inventor： Nirmal Chindhu Warke , Srinath Hosur , Martin J. Izzard , Siraj Akhtar , Baher S. Haroun , Marco Corsi
IPC: H04W40/00 , H01Q3/26 , H01Q21/00 , H04L12/935 , H04L12/931 , H04W40/06 , H04W40/12
CPC classification number: H04W40/00 , H01Q3/26 , H01Q9/20 , H01Q21/0006 , H01Q21/0037 , H04B7/0617 , H04B17/336 , H04L45/74 , H04L49/3009 , H04L49/40 , H04W40/06 , H04W40/12 , Y02D70/00 , Y02D70/166 , Y02D70/322 , Y02D70/34
Abstract: Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. A router or switch receives data packets at input port ASICs. A routing table on the input port ASIC or on a routing ASIC is used to identify a destination port ASIC based upon header information in the data packet. The data packet is transmitted from the input port ASIC to the destination port ASIC using millimeter wave signals that are transmitted across a waveguide or a wireless interface.
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公开(公告)号：US20130258892A1
公开(公告)日：2013-10-03
申请号：US13901814
申请日：2013-05-24
Applicant: Texas Instruments Incorporated
Inventor： Nirmal Chindhu Warke , Srinath Hosur , Martin J. Izzard , Siraj Akhtar , Baher S. Haroun , Marco Corsi
IPC: H04W40/00
CPC classification number: H04W40/00 , H01Q3/26 , H01Q9/20 , H01Q21/0006 , H01Q21/0037 , H04B7/0617 , H04B17/336 , H04L45/74 , H04L49/3009 , H04L49/40 , H04W40/06 , H04W40/12 , Y02D70/00 , Y02D70/166 , Y02D70/322 , Y02D70/34
Abstract: Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. A router or switch receives data packets at input port ASICs. A routing table on the input port ASIC or on a routing ASIC is used to identify a destination port ASIC based upon header information in the data packet. The data packet is transmitted from the input port ASIC to the destination port ASIC using millimeter wave signals that are transmitted across a waveguide or a wireless interface.
Abstract translation: 本发明的实施例提供了一种用于电子电路中芯片到芯片通信的系统和方法。 路由器或交换机在输入端口ASIC处接收数据包。 输入端口ASIC或路由ASIC上的路由表用于根据数据包中的报头信息识别目标端口ASIC。 使用在波导或无线接口上传输的毫米波信号，将数据分组从输入端口ASIC发送到目标端口ASIC。
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公开(公告)号：US20130038480A1
公开(公告)日：2013-02-14
申请号：US13654575
申请日：2012-10-18
Applicant: Texas Instruments Incorporated
Inventor： Marco Corsi , Robert F. Payne
CPC classification number: G11C27/026 , H03M1/0624 , H03M1/1245
Abstract: A track-and-hold circuit is provided. This track-and-hold circuit is adapted to track an analog input signal and hold a sampled voltage of the analog input signal at a sampling instant for processing by other circuitry, in response to a track signal that alternates with a hold signal. Preferably, the track-and-hold circuit includes a bi-directional current source that sources and sinks current through a first output node and a second output node, a unity gain amplifier that is coupled to first and second output nodes of the bi-directional current source and that receives the analog input signal, a resistor coupled to an output of the unity gain amplifier, and a capacitor coupled between the resistor and ground. Of interest, however, is the bi-directional current source, which includes a differential input circuit that is adapted to receive the track signal and the hold signal and that is coupled to the first and second output nodes and an RC network that is coupled to the differential input circuit. The RC network receives the analog input signal and is scaled to change the location of a zero to reduce the signal-dependence of the sampling instant.
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