公开(公告)号：US10692964B2

公开(公告)日：2020-06-23

申请号：US16023377

申请日：2018-06-29

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Roberto Giampiero Massolini ,  Daniel Carothers

IPC: H01L21/00 ,  H01L49/02 ,  H01L23/495 ,  H01L27/06 ,  H01L21/3065 ,  H01L21/768 ,  H01L23/498 ,  H01L23/00

Abstract: An integrated circuit (IC) includes a circuit substrate having a front side surface and an opposite back side surface. Active circuitry is located on the front side surface. An inductive structure is located within a deep trench formed in the circuit substrate below the backside surface. The inductive structure is coupled to the active circuitry.

公开(公告)号：US10396016B2

公开(公告)日：2019-08-27

申请号：US15395429

申请日：2016-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Joyce Marie Mullenix ,  Roberto Giampiero Massolini ,  Kristen Nguyen Parrish ,  Osvalod Jorge Lopez ,  Jonathan Almeria Noquil

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/552 ,  H01L23/64

Abstract: One example includes a device that is comprised of a die, a leadframe, and an electrically conductive material. The die includes a circuit therein. The leadframe is coupled with the die and the circuit therein. The electrically conductive material is disposed in a space above the die opposite the leadframe, the electrically conductive material being coupled to the leadframe and configured as one or more turns thereof to form at least one inductor.

公开(公告)号：US20170330930A1

公开(公告)日：2017-11-16

申请号：US15152518

申请日：2016-05-11

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Roberto Giampiero Massolini ,  Daniel Carothers

IPC: H01L49/02 ,  H01L23/495 ,  H01L21/3065 ,  H01L21/768 ,  H01L23/498

CPC classification number: H01L28/10 ,  H01L21/30655 ,  H01L21/76877 ,  H01L23/49541 ,  H01L23/49811 ,  H01L23/49827

Abstract: An integrated circuit (IC) that includes a circuit substrate having a front side surface and an opposite back side surface. Active circuitry is located on the front side surface. An inductive structure is located within a deep trench formed in the circuit substrate below the backside surface. The inductive structure is coupled to the active circuitry.

公开(公告)号：US20170194088A1

公开(公告)日：2017-07-06

申请号：US14984631

申请日：2015-12-30

Applicant: Texas Instruments Incorporated

Inventor： Roberto Giampiero Massolini ,  Vijaylaxmi Khanolkar ,  Joyce Mullenix ,  Rais Miftakhutdinov

IPC: H01F27/28

CPC classification number: H01F27/2804 ,  H01F27/365 ,  H01F2027/2809 ,  H01F2027/2819

Abstract: A transformer for module integration includes a first layer of magnetic material having an outer edge, a second layer of magnetic material having an outer edge, and an isolation layer positioned between the first layer of magnetic material and the second layer of magnetic material along a primary axis. The transformer includes a first inductive element positioned in the first layer of magnetic material and a second inductive element disposed opposite of the first inductive element and in the second layer of magnetic material.

公开(公告)号：US20170178787A1

公开(公告)日：2017-06-22

申请号：US14974901

申请日：2015-12-18

Applicant: Texas Instruments Incorporated

Inventor： Roberto Giampiero Massolini ,  Vijaylaxmi Khanolkar ,  Joyce Mullenix ,  Rais Miftakhutdinov

IPC: H01F27/28 ,  B22F5/12 ,  H01F41/02 ,  B22F3/10 ,  H01F27/24 ,  H01F41/04

CPC classification number: H01F27/2804 ,  B22F3/10 ,  B22F5/12 ,  B22F7/06 ,  B22F2999/00 ,  C22C2202/02 ,  H01F27/24 ,  H01F27/288 ,  H01F41/0206 ,  H01F41/04 ,  H01F41/046 ,  H01F2027/2809 ,  H01F2027/2819 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/181 ,  B22F1/0059 ,  H01L2924/00012

Abstract: Methods and apparatus for isolation barrier with magnetics. In an example arrangement, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also disclosed.

公开(公告)号：US11756718B2

公开(公告)日：2023-09-12

申请号：US16236571

申请日：2018-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix

IPC: H01F17/00 ,  H01F19/08 ,  H01L25/16

CPC classification number: H01F19/08 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0086 ,  H01F2019/085 ,  H01L25/16

Abstract: A transformer respectively includes a first isolation barrier, a first inductive element, a second isolation barrier, and a second inductive element. The first isolation barrier and second isolation barrier each comprise multiple isolation layers. The transformer also includes magnetic material including a top magnetic portion disposed above the first isolation barrier. The transformer also includes a bottom magnetic portion disposed below the second inductive element; The transformer further includes an intermediary magnetic portion extending from the top magnetic portion to the bottom magnetic portion via a through-hole within the first isolation barrier, first inductive element, second isolation barrier, and second inductive element. The transformer yet further includes at least one lateral magnetic portion extending from the top magnetic portion to the bottom magnetic portion. The at least one lateral magnetic portion is disposed laterally from the first isolation barrier, first inductive element, second isolation barrier, and second inductive element.

公开(公告)号：US10432102B2

公开(公告)日：2019-10-01

申请号：US15712330

申请日：2017-09-22

Applicant: Texas Instruments Incorporated

Inventor： Pierluigi Albertini ,  Maurizio Granato ,  Giacomo Calabrese ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix ,  Giovanni Frattini

IPC: H02M3/335 ,  H03L7/08 ,  H02M1/00

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.

公开(公告)号：US20190229637A1

公开(公告)日：2019-07-25

申请号：US16367691

申请日：2019-03-28

Applicant: Texas Instruments Incorporated

Inventor： Pierluigi Albertini ,  Maurizio Granato ,  Giacomo Calabrese ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix ,  Giovanni Frattini

IPC: H02M3/335 ,  H03L7/08

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.

公开(公告)号：US20190097544A1

公开(公告)日：2019-03-28

申请号：US15712330

申请日：2017-09-22

Applicant: Texas Instruments Incorporated

Inventor： Pierluigi Albertini ,  Maurizio Granato ,  Giacomo Calabrese ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix ,  Giovanni Frattini

IPC: H02M3/335 ,  H03L7/08

CPC classification number: H02M3/33592 ,  H02M3/33584 ,  H02M2001/0003 ,  H03L7/0807

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.

公开(公告)号：US20180323254A1

公开(公告)日：2018-11-08

申请号：US16023377

申请日：2018-06-29

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Roberto Giampiero Massolini ,  Daniel Carothers

IPC: H01L49/02 ,  H01L21/3065 ,  H01L23/498 ,  H01L21/768 ,  H01L23/495

Abstract: An integrated circuit (IC) includes a circuit substrate having a front side surface and an opposite back side surface. Active circuitry is located on the front side surface. An inductive structure is located within a deep trench formed in the circuit substrate below the backside surface. The inductive structure is coupled to the active circuitry.