公开(公告)号：US20220189836A1

公开(公告)日：2022-06-16

申请号：US17469480

申请日：2021-09-08

Applicant: Texas Instruments Incorporated

Inventor： William Robert Morrison ,  Bradley Morgan Haskett

IPC: H01L23/13 ,  H01L23/08 ,  H01L23/31 ,  H01L23/00

Abstract: An example includes: a substrate having a first package surface, having a second package surface opposite the first package surface, and having a die cavity with a depth extending into the first package surface; a semiconductor die having bond pads on a first die surface and having a second die surface opposite the first die surface, the semiconductor die having a die thickness, the second die surface of the semiconductor die mounted in the die cavity; a cover over a portion of the first die surface; conductors coupling the bond pads of the semiconductor die to bond fingers on the first package surface of the substrate; and dielectric material over the conductors, the bond fingers, the bond pads, at least a portion of the first semiconductor die and at least a portion of the cover, wherein the dielectric material extends above the first package surface of the substrate.

公开(公告)号：US08803296B2

公开(公告)日：2014-08-12

申请号：US13784423

申请日：2013-03-04

Applicant: Texas Instruments Incorporated

Inventor： William Robert Morrison ,  Mark Christopher Fisher ,  Murali Hanabe ,  Ganapathy Subramaniam Sivakumar ,  Simon Joshua Jacobs

IPC: H01L23/58 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00984 ,  B81B3/0005 ,  B81B7/0032 ,  B81C1/00261 ,  B81C1/0096 ,  B81C2201/112 ,  H01L21/02112 ,  H04W4/02 ,  Y10S257/914

Abstract: A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n≧2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.

Abstract translation: 器件具有微机电系统（MEMS）部件，其中至少一个表面和涂层设置在表面的至少一部分上。 该涂层具有式M（CnF2n + 10r）的化合物，其中M是极性头基，其中n≥2r。 n的值可以在2至约20的范围内，并且r的值可以在1至约10的范围内.n加r的值可以在3至约30的范围内，并且n：r的比可以具有值 为约2：1至约20：1。

公开(公告)号：US11923258B2

公开(公告)日：2024-03-05

申请号：US17469480

申请日：2021-09-08

Applicant: Texas Instruments Incorporated

Inventor： William Robert Morrison ,  Bradley Morgan Haskett

IPC: H01L23/13 ,  H01L23/00 ,  H01L23/08 ,  H01L23/31

CPC classification number: H01L23/13 ,  H01L23/08 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48227

Abstract: An example includes: a substrate having a first package surface, having a second package surface opposite the first package surface, and having a die cavity with a depth extending into the first package surface; a semiconductor die having bond pads on a first die surface and having a second die surface opposite the first die surface, the semiconductor die having a die thickness, the second die surface of the semiconductor die mounted in the die cavity; a cover over a portion of the first die surface; conductors coupling the bond pads of the semiconductor die to bond fingers on the first package surface of the substrate; and dielectric material over the conductors, the bond fingers, the bond pads, at least a portion of the first semiconductor die and at least a portion of the cover, wherein the dielectric material extends above the first package surface of the substrate.

公开(公告)号：US09487397B2

公开(公告)日：2016-11-08

申请号：US14844779

申请日：2015-09-03

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： William Robert Morrison ,  Mark Christopher Fisher ,  Murali Hanabe ,  Ganapathy Subramaniam Sivakumar ,  Simon Joshua Jacobs

IPC: H01L21/322 ,  B81C1/00 ,  B81B7/00 ,  H04W4/02 ,  H01L21/02 ,  B81B3/00

CPC classification number: B81C1/00984 ,  B81B3/0005 ,  B81B7/0032 ,  B81C1/00261 ,  B81C1/0096 ,  B81C2201/112 ,  H01L21/02112 ,  H04W4/02 ,  Y10S257/914

Abstract: A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n≧2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.

公开(公告)号：US09150410B2

公开(公告)日：2015-10-06

申请号：US14333829

申请日：2014-07-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： William Robert Morrison ,  Mark Christopher Fisher ,  Murali Hanabe ,  Ganapathy Subramaniam Sivakumar ,  Simon Joshua Jacobs

IPC: H01L21/31 ,  H01L21/469 ,  B81C1/00 ,  B81B7/00 ,  H04W4/02 ,  H01L21/02 ,  B81B3/00

CPC classification number: B81C1/00984 ,  B81B3/0005 ,  B81B7/0032 ,  B81C1/00261 ,  B81C1/0096 ,  B81C2201/112 ,  H01L21/02112 ,  H04W4/02 ,  Y10S257/914

Abstract: A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n≧2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.

Abstract translation: 器件具有微机电系统（MEMS）部件，其中至少一个表面和涂层设置在表面的至少一部分上。 该涂层具有式M（CnF2n + 10r）的化合物，其中M是极性头基，其中n≥2r。 n的值可以在2至约20的范围内，并且r的值可以在1至约10的范围内.n加r的值可以在3至约30的范围内，并且n：r的比可以具有值 为约2：1至约20：1。