公开(公告)号：US20250046621A1

公开(公告)日：2025-02-06

申请号：US18362635

申请日：2023-07-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Nazila Dadvand ,  Xuan Mo Li ,  Huo Yun Duan

IPC: H01L21/48 ,  H01L21/683 ,  H01L23/495

Abstract: A method for forming integrated circuit (IC) packages includes mounting tape on a mold compound of a strip of flat no-leads IC packages. The method also includes sawing the mold compound of the strip of flat no-leads IC packages to form singulated IC packages mounted on the tape. The method further includes immersing the singulated IC packages in a bath of immersion tin to form immersion tin plating on a flank of leads of the singulated IC packages.