公开(公告)号：US12127341B2

公开(公告)日：2024-10-22

申请号：US17875683

申请日：2022-07-28

Applicant: THALES

Inventor： Geoffroy Aupee ,  Pierre-Yves Michaud

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K1/181 ,  H05K3/10 ,  H05K3/42 ,  H05K3/4697 ,  H05K3/0094 ,  H05K3/04 ,  H05K2201/09372

Abstract: Embodiments provide a multilayer printed circuit board intended to connect electronic components, the board comprising a stack of a plurality of conductive layers, the conductive layers comprising two surface layers and one or more internal layers, the board comprising one or more counterbored holes, each counterbored hole comprising a portion with metallization opening onto one of the two surface layers and a portion without metallization opening onto the other surface layer; the multilayer printed circuit board may advantageously comprise one or more metal pads, each metal pad being joined to one of the two surface layers so as to occult the portion without metallization of a corresponding counterbored hole.