SYSTEMS AND METHODS FOR ANALYZING A BONDLINE
    1.
    发明申请
    SYSTEMS AND METHODS FOR ANALYZING A BONDLINE 有权
    用于分析BONDLINE的系统和方法

    公开(公告)号:US20160078607A1

    公开(公告)日:2016-03-17

    申请号:US14486461

    申请日:2014-09-15

    Abstract: A method for analyzing a bondline in a structure is provided. The method includes obtaining, from a first side of the structure, by at least one computing device, at least one first internal image of the structure that includes at least a first pattern associated with the bondline, wherein the structure is in a pre-loaded state and obtaining, from the first side of the structure, by the at least one computing device, at least one second internal image of the structure that includes at least the first pattern, wherein the structure is in a loaded state. Additionally, the method includes comparing, by the at least one computing device, the at least one first internal image with the at least one second internal image, and determining, by the at least one computing device, at least one stress and/or strain-related property of the bondline based on the comparison. The method additionally includes predicting an estimated life of the bondline, whereby the estimated life provides a valuable tool for optimization of maintenance effort and enabling cost-optimal maintenance decisions.

    Abstract translation: 提供了一种用于分析结构中的粘结线的方法。 所述方法包括从所述结构的第一侧通过至少一个计算设备获得所述结构的至少一个第一内部图像,所述至少一个第一内部图像至少包括与所述粘合线相关联的第一图案,其中所述结构处于预加载 并且从所述结构的第一侧由所述至少一个计算设备获得至少包括所述第一图案的所述结构的至少一个第二内部图像,其中所述结构处于加载状态。 另外,该方法包括通过至少一个计算设备将至少一个第一内部图像与至少一个第二内部图像进行比较,以及由至少一个计算设备确定至少一个应力和/或应变 基于比较的绑定线的相关属性。 该方法还包括预测粘合线的估计寿命,由此估计寿命为优化维护工作提供了有价值的工具,并且能够实现成本最优化的维护决策。

    Systems and methods for analyzing a bondline
    2.
    发明授权
    Systems and methods for analyzing a bondline 有权
    用于分析粘合线的系统和方法

    公开(公告)号:US09443300B2

    公开(公告)日:2016-09-13

    申请号:US14486461

    申请日:2014-09-15

    Abstract: A method for analyzing a bondline in a structure is provided. The method includes obtaining, from a first side of the structure, by at least one computing device, at least one first internal image of the structure that includes at least a first pattern associated with the bondline, wherein the structure is in a pre-loaded state and obtaining, from the first side of the structure, by the at least one computing device, at least one second internal image of the structure that includes at least the first pattern, wherein the structure is in a loaded state. Additionally, the method includes comparing, by the at least one computing device, the at least one first internal image with the at least one second internal image, and determining, by the at least one computing device, at least one stress and/or strain-related property of the bondline based on the comparison. The method additionally includes predicting an estimated life of the bondline, whereby the estimated life provides a valuable tool for optimization of maintenance effort and enabling cost-optimal maintenance decisions.

    Abstract translation: 提供了一种用于分析结构中的粘结线的方法。 所述方法包括从所述结构的第一侧通过至少一个计算设备获得所述结构的至少一个第一内部图像,所述至少一个第一内部图像至少包括与所述粘合线相关联的第一图案,其中所述结构处于预加载 并且从所述结构的第一侧由所述至少一个计算设备获得至少包括所述第一图案的所述结构的至少一个第二内部图像,其中所述结构处于加载状态。 另外,该方法包括通过至少一个计算设备将至少一个第一内部图像与至少一个第二内部图像进行比较,以及由至少一个计算设备确定至少一个应力和/或应变 基于比较的绑定线的相关属性。 该方法还包括预测粘合线的估计寿命,由此估计寿命为优化维护工作提供了有价值的工具,并且能够实现成本最优化的维护决策。

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