公开(公告)号：EP0272823A3

公开(公告)日：1989-11-02

申请号：EP87310627.2

申请日：1987-12-03

Applicant: THE GENERAL ELECTRIC COMPANY, p.l.c.

Inventor： Kidd, Jonathan

IPC: H05K3/00 ,  H05K3/46

CPC classification number: H05K3/4667 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/0017 ,  H05K3/4644 ,  H05K2203/0511

Abstract: An electrical circuit arrangement includes a conductive link through an insulating layer separating two conductive layers. This link is formed by placing an evaporable plug on a first conductive layer, forming the insulating layer around it and then vapourising the plug. The resulting gap is then infilled with conductive material and a second conductive layer formed on the insulating layer.

公开(公告)号：EP0272823A2

公开(公告)日：1988-06-29

申请号：EP87310627.2

申请日：1987-12-03

Applicant: THE GENERAL ELECTRIC COMPANY, p.l.c.

Inventor： Kidd, Jonathan

IPC: H05K3/00 ,  H05K3/46

CPC classification number: H05K3/4667 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/0017 ,  H05K3/4644 ,  H05K2203/0511

Abstract: An electrical circuit arrangement includes a conductive link through an insulating layer separating two conductive layers. This link is formed by placing an evaporable plug on a first conductive layer, forming the insulating layer around it and then vapourising the plug. The resulting gap is then infilled with conductive material and a second conductive layer formed on the insulating layer.

Abstract translation: 电路装置包括通过分离两个导电层的绝缘层的导电连接。 该连接通过在第一导电层上放置可蒸发的塞子形成，在其上形成绝缘层，然后蒸发塞子。 然后产生的间隙填充有导电材料和形成在绝缘层上的第二导电层。