Use of sacrificial layers in the manufacture of high performance systems on tailored substrates
    2.
    发明申请
    Use of sacrificial layers in the manufacture of high performance systems on tailored substrates 失效
    在定制底材上制造高性能系统时使用牺牲层

    公开(公告)号:US20030157783A1

    公开(公告)日:2003-08-21

    申请号:US10340723

    申请日:2003-01-13

    Abstract: The invention relates to methods for preparing a removable system on a mother substrate. The method deposits a high surface to volume sacrificial layer on a mother substrate and stabilizes the sacrificial layer by a) removing volatile chemical species in and on the sacrificial layer and/or b) modifying the surface of the layer. The method coats over the sacrificial layer with a capping medium. A system is the fabricated on the capping medium. The method provides through holes to access the sacrificial layer. The method may also apply a top layer onto the system to form a covered system. The invention also includes the step of removing the sacrificial layer to release the system from the mother substrate. Methods of the invention also include selectively removing a portion of the system and capping layers to form void regions defining an array of islands composed of device, structure, or system and capping layer regions, and optionally filling the island-defining void region with a sacrificial material. In such methods the sacrificial material and the high surface to volume sacrificial layer are removed to release the system from the mother substrate. Methods of the invention also include applying a layer to the capping material side of the released system to form a configuration wherein the system is substantially within a bending-stress reduced neutral plane. The systems fabricated according to the invention may be placed on a wide variety of suitable substrates, including flexible substrates.

    Abstract translation: 本发明涉及在母基板上制备可移除系统的方法。 该方法在母体衬底上沉积高表面到体积的牺牲层,并通过以下步骤使牺牲层稳定:a)去除牺牲层中和/或牺牲层上的挥发性化学物质和/或b)改变该层的表面。 该方法用覆盖介质涂覆在牺牲层上。 系统是在封盖介质上制造的。 该方法提供通孔以进入牺牲层。 该方法还可以将顶层应用到系统上以形成被覆盖的系统。 本发明还包括去除牺牲层以从母体衬底释放系统的步骤。 本发明的方法还包括选择性地去除系统的一部分和封盖层,以形成限定由器件,结构或系统和覆盖层区域组成的岛阵列的空隙区域,并且可选地用牺牲层填充岛状限定空隙区域 材料。 在这种方法中,去除了牺牲材料和高表面到体积的牺牲层,以从母体衬底释放系统。 本发明的方法还包括向释放系统的封盖材料侧施加一层以形成其中系统基本上在弯曲应力减小的中性平面内的构造。 根据本发明制造的系统可以放置在各种合适的基板上,包括柔性基板。

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