PATTERNING BY STAMPED METAL RESIST
    2.
    发明申请
    PATTERNING BY STAMPED METAL RESIST 审中-公开
    压印金属电阻图案

    公开(公告)号:WO2010039940A1

    公开(公告)日:2010-04-08

    申请号:PCT/US2009/059205

    申请日:2009-10-01

    CPC classification number: H01L51/0021

    Abstract: A method is provided. A first layer is provided over a substrate, the first layer comprising a first material. A patterned second layer is applied over the first layer via stamping. The second layer comprising a second material. The second layer covers a first portion of the first layer, and does not cover a second portion of the first layer. The second portion of the first layer is removed via a subtractive process while the first portion of the first layer is protected from removal by the patterned second layer.

    Abstract translation: 提供了一种方法。 第一层设置在衬底上,第一层包括第一材料。 图案化的第二层通过冲压施加在第一层上。 第二层包括第二材料。 第二层覆盖第一层的第一部分,并且不覆盖第一层的第二部分。 第一层的第二部分通过减法处理被去除,同时保护第一层的第一部分不被图案化的第二层移除。

    METHOD AND SYSTEM FOR CREATING PHOTOSENSITIVE ARRAY WITH INTEGRATED BACKPLANE
    3.
    发明申请
    METHOD AND SYSTEM FOR CREATING PHOTOSENSITIVE ARRAY WITH INTEGRATED BACKPLANE 审中-公开
    用于创建具有集成背景的感光阵列的方法和系统

    公开(公告)号:WO2009102786A1

    公开(公告)日:2009-08-20

    申请号:PCT/US2009/033791

    申请日:2009-02-11

    Abstract: A method of fabricating a photoactive array having an integrated backplane is provided. The layers of the device may be stamped or deposited on a planar or a curved substrate, such as a semispherical or ellipsoidal substrate. Each metal layer may be stamped using an elastomeric stamp and a vacuum mold. By depositing the patterned and full-surface layers in a single process, a photosensitive array with an integrated transistor backplane may be fabricated, resulting in improved sensitivity and performance.

    Abstract translation: 提供一种制造具有集成背板的光活性阵列的方法。 该装置的层可以冲压或沉积在平面或弯曲的基底上,例如半球形或椭圆形基底。 可以使用弹性体印模和真空模具对每个金属层进行冲压。 通过将图案化和全表面层沉积在单个工艺中,可以制造具有集成晶体管背板的光敏阵列,从而提高灵敏度和性能。

    CONCAVE-HEMISPHERE-PATTERNED ORGANIC TOP-LIGHT EMITTING DEVICE
    4.
    发明申请
    CONCAVE-HEMISPHERE-PATTERNED ORGANIC TOP-LIGHT EMITTING DEVICE 审中-公开
    凹凸图案有机顶灯发光装置

    公开(公告)号:WO2010111495A1

    公开(公告)日:2010-09-30

    申请号:PCT/US2010/028672

    申请日:2010-03-25

    Abstract: A first device is provided. The first device includes an organic light emitting device, which further comprises a first electrode, a second electrode, and an organic emissive layer disposed between the first and second electrode. Preferably, the second electrode is more transparent than the first electrode. The organic emissive layer has a first portion shaped to form an indentation in the direction of the first electrode, and a second portion shaped to form a protrusion in the direction of the second electrode. The first device may include a plurality of organic light emitting devices. The indentation may have a shape that is formed from a partial sphere, a partial cylinder, a pyramid, or a pyramid with a mesa, among others. The protrusions may be formed between adjoining indentations or between an indentation and a surface parallel to the substrate.

    Abstract translation: 提供第一个设备。 第一器件包括有机发光器件,其还包括设置在第一和第二电极之间的第一电极,第二电极和有机发光层。 优选地,第二电极比第一电极更透明。 有机发光层具有成形为在第一电极的方向上形成凹陷的第一部分和形成为在第二电极的方向上形成突起的第二部分。 第一装置可以包括多个有机发光装置。 凹陷可以具有由局部球体,部分圆柱体,金字塔形或具有台面的金字塔等形成的形状。 突起可以形成在相邻的凹陷之间或者在凹陷和平行于基底的表面之间。

    SYSTEM AND METHOD OF FORMING SEMICONDUCTOR DEVICES

    公开(公告)号:WO2012116324A9

    公开(公告)日:2012-08-30

    申请号:PCT/US2012/026611

    申请日:2012-02-24

    Abstract: Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

    ROLL-TO-ROLL FABRICATION OF MICROLENS ARRAYS
    8.
    发明申请
    ROLL-TO-ROLL FABRICATION OF MICROLENS ARRAYS 审中-公开
    微孔阵列的轧辊轧制

    公开(公告)号:WO2009006294A2

    公开(公告)日:2009-01-08

    申请号:PCT/US2008/068562

    申请日:2008-06-27

    CPC classification number: B29D11/00365 G02B3/0031

    Abstract: A patterned roller, and a method of making the patterned roller, is provided. A patterned roller may be made by first forming a first mold having a negative pattern in a flat surface by etching. A second mold is formed having a positive pattern, by pouring a first curable material into the first mold and processing. The patterned roller having the negative pattern is formed by coating a roller with a layer of a second curable material, pre-curing the second curable material, and rolling the roller over the second mold. The second curable material is then cured. A metal coating may be applied after curing any of the materials to reduce sticking in subsequent steps. The patterned roller may be used to create a pattern of microlenses in a third curable material by rolling.

    Abstract translation: 提供了图案化辊,以及制造图案辊的方法。 可以通过首先通过蚀刻在平坦表面中形成具有负图案的第一模具来制造图案化辊。 通过将第一可固化材料倒入第一模具中并形成具有正图案的第二模具。 具有负图案的图案化辊通过涂覆具有第二可固化材料层的辊,预固化第二可固化材料并在第二模具上滚动辊而形成。 然后固化第二可固化材料。 在固化任何材料之后可以施加金属涂层,以减少后续步骤中的粘附。 图案化辊可用于通过轧制在第三可固化材料中产生微透镜图案。

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