公开(公告)号：US20180019226A1

公开(公告)日：2018-01-18

申请号：US15644379

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka MATSUNAGA ,  Takahiro MASUNAGA ,  Yasutaka SOMA ,  Takashi KOGA ,  Shogo HARA ,  Masaaki UMITSUKI ,  Kazutoshi ISHIMARU ,  Fumio SAKATA

IPC: H01L23/00 ,  B32B37/00 ,  B32B41/00

CPC classification number: H01L24/83 ,  B32B37/025 ,  B32B41/00 ,  B32B2457/14 ,  H01L24/74 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/74 ,  H01L2224/7501 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75743 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75901 ,  H01L2224/80009 ,  H01L2224/80013 ,  H01L2224/8002 ,  H01L2224/80123 ,  H01L2224/80129 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83031 ,  H01L2224/83122 ,  H01L2224/83896 ,  H01L2224/94 ,  H01L2224/80 ,  H01L2924/00012

Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.

公开(公告)号：US20180019153A1

公开(公告)日：2018-01-18

申请号：US15644318

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka MATSUNAGA ,  Takahiro MASUNAGA ,  Takashi KOGA ,  Yasuharu IWASHITA ,  Shingo KATSUKI ,  Masaaki UMITSUKI ,  Kazutoshi ISHIMARU ,  Fumio SAKATA

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/67

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

公开(公告)号：US20180019225A1

公开(公告)日：2018-01-18

申请号：US15644292

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka MATSUNAGA ,  Takashi KOGA ,  Takeshi TAMURA ,  Takahiro MASUNAGA ,  Yuji MIMURA ,  Masaru HONDA ,  Toshifumi INAMASU ,  Satoshi NISHIMURA

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L21/187 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/67155 ,  H01L21/677 ,  H01L24/75 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75743 ,  H01L2224/83031 ,  H01L2224/83122 ,  H01L2224/83896 ,  H05K13/0015 ,  H05K13/0061 ,  Y10T29/53091 ,  Y10T29/53096 ,  Y10T29/5317 ,  Y10T29/53187 ,  Y10T29/53261

Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.